IC Manufacturing, Package&Test


2024-08-19

[News] Samsung Reportedly to Bring in High-NA EUV Machine as soon as Year-End, as SK hynix Targets 2026

IC Manufacturing, Package&Test

As semiconductor giants, starting with Intel and TSMC, have been bringing in ASML’s High-NA EUV (high-numerical aperture extreme ultraviolet) equipment to accelerate the development in advanced nodes, the elite group has now reportedly been added two new members: Samsung and SK hynix. According...

2024-08-16

[News] The Semiconductor Giant Falling from Grace: Intel and the CEOs Who Changed Its Destiny

IC Manufacturing, Package&Test

After the disappointing financial performance in Q2, Intel has been plagued by a series of challenges. Its shares plunged, falling to the lowest point in over a decade, coupling with the suspension of dividend payouts, layoffs, and product failures. The company may be facing its worst moment in 50 y...

2024-08-12

[News] Samsung’s Foundry Business Reportedly Struggles with Losses behind Soaring Profits in Q2

IC Manufacturing, Package&Test

In spite of its skyrocketing profit in Q2 thanks to the strong AI demand for memory chips, Samsung Electronics might be still struggling with losses in its foundry business, according to reports by ijiwei and Technews. Citing Korean media, the reports indicate that Samsung’s foundry business is...

2024-08-09

[News] Intel Delays Innovation 2024 Event amid Financial Challenges, Arousing Public’s Curiosity on 18A

IC Manufacturing, Package&Test

Last week, semiconductor giant Intel reported weak quarterly earnings, with announcements made on a massive 15% cut of workforce and an over 20% reduction on capital expenditures in 2024. Now the company seems to make up its mind on cost-cutting, as it has started notifying attendees that its fall I...

2024-08-09

[News] Samsung to Intensify Efforts for Capturing Intel’s Advanced Packaging Orders Shifting from TSMC

IC Manufacturing, Package&Test

According to a report from The Chosun Daily, major tech companies like NVIDIA are considering using Intel's foundry services (IFS) as an alternative due to TSMC's packaging capacity shortages. While packaging is a core competency for semiconductor foundries, Samsung, which is facing difficulties in ...

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