Amidst geopolitical influences, governments worldwide are enticing semiconductor manufacturers with subsidy policies, prompting chip manufactures to establish themselves in various regions. The ongoing dynamics of semiconductor facility construction and the evolving global production capacity remain focal points for the industry in 2024.

Following TSMC’s establishment of facilities in Arizona, USA, and Kumamoto, Japan, the progress of TSMC’s second Kumamoto plant has garnered significant industry attention. On another front, the developments at TSMC’s ESMC facility in Germany continue to capture global attention within the semiconductor industry.

Powerchip Semiconductor Corporation (PSMC) also made headlines in 2023 by announcing the construction of its first overseas 12-inch fab, JSMC, located in Sendai City, Miyagi Prefecture, Japan.

Meanwhile, Samsung’s overseas expansion efforts are equally robust. In addition to its Taylor plant in the United States, Samsung plans to establish a new semiconductor packaging research center in Japan.

According to TrendForce data, considering an equivalent foundry capacity of 12 inches, Taiwan held a global market share of approximately 47% in 2023, followed by China at 26%, South Korea at 12%, the United States at 6%, Singapore at 4%, Japan at 2%, Germany at 1%, and others at 2%. By 2027, Taiwan’s market share is projected to decrease to 42%, with China at 28%, South Korea at 10%, the United States at 7%, Singapore at 6%, Japan at 3%, Germany at 2%, and others at 1%.

(Image: TSMC)

Chinese iPhone assembly contractor Luxshare Precision is set to officially acquire the controlling stake of Pegaglobe (Kunshan), the iPhone assembly plant under Pegatron. This series of acquisitions will provide Luxshare with a stronger competitive advantage against Foxconn. Concurrently, Luxshare is reinforcing its component layout to enhance its capability to expand iPhone orders.

Following the acquisition of Wistron’s Jiangsu and Kunshan plant, Luxshare has now secured the controlling stake of Pegaglobe (Kunshan), a subsidiary of Pegatron. This marks another acquisition of China’s plants involved in manufacturing iPhone for Taiwanese companies.

According to UDN citing from industry insiders,  Luxshare’s acquisition of Pegaglobe (Kunshan) is likely to have received Apple’s approval. Luxshare has consecutively broken the pattern of iPhones being solely manufactured by Taiwanese companies, suggesting that Luxshare has the opportunity to reshape the landscape of iPhone manufacturing in the future.

Having acquired iPhone manufacturing plants in China from Wistron and Pegatron, Luxshare not only gains more market share in manufacturing but also expands its presence in the upstream iPhone component supply chain. This ongoing integration of upstream components enhances Luxshare’s capability to secure more iPhone orders.

In the past three years, Luxshare has been consistently acquiring iPhone-related supply chain entities. In July 2020, Luxshare’s subsidiary, Lizhen Precision (Jiangsu), acquired Wistron Investment (Jiangsu) and Wistron InfoComm Manufacturing (Kunshan) for RMB 3.3 billion (approximately USD 467 million), marking the beginning of Luxshare’s acquisition of plants involved in iPhones assembly for Taiwanese companies.

Recently, Luxshare finalized an agreement with the global provider of connectivity and power solutions – Qorvo. Luxshare will acquire Qorvo’s testing and packaging facilities in Beijing and Dezhou, with the transaction expected to be completed in the first half of next year. This move is seen as Luxshare’s effort to build a more comprehensive iPhone component supply chain.

Read more

• [News] Apple Supplier Qorvo Sells Chinese Test and Packaging Plant to Luxshare
• [News] Tata Group Plans to Build New iPhone Assembly Plant in India, Aligning with Apple’s Localization Strategy for the Supply Chain

(Photo credit: Luxshare)

After a rebound from the decline in NAND prices, the current quotations still show a gap from reaching the breakeven point for suppliers such as Samsung, Kioxia, SK Hynix, and Micron.

Major domestic players in the NAND Flash industry indicate that NAND Flash suppliers, driven by the goal of profitability, will continue to aggressively raise prices. It is anticipated that prices will need to increase by over 40% once again for major manufacturers to break even. To achieve profitability, future price hikes are expected to be at least 50% or even higher, according to Economic Daily News.

Looking at the global NAND Flash market share in 3Q23, according to a report from TrendForce, Samsung holds the leading position with a market share of 31.4%. The second position is held by the SK group, with a market share of 20.2%, followed by the U.S.-based Western Digital at third place with a market share of 16.9%. The Japanese company, Kioxia ranks fourth with a market share of approximately 14.5%.

The industry indicates that due to the lower profitability of NAND Flash compared to DRAM, international giants are actively reducing NAND Flash production.

Taking Samsung as an example, since September of this year, the reduction in NAND chip production has expanded to 50% of total capacity, focusing on products with stacked layers up to 128 layers. The goal is to accelerate destocking and stabilize prices, with plans to gradually increase prices in 2024.

TrendForce has indicated that following Samsung’s expansion of the production reduction to 50%, other suppliers are also maintaining a restrained wafer allocation strategy. After more than half a year of production reduction in some processes and capacities, there is a structural supply shortage, providing an advantage for chip manufacturers in price control. Observing the market in the fourth quarter, there are almost no low-priced sources available for purchase. However, buyers still tend to maintain high inventory levels and continue purchasing.

Industry sources revealed that the NAND chip prices had plummeted too deeply before. Although the quarterly increase in contract prices seems substantial, there is still a distance for chip manufacturers to achieve a turnaround. It is expected that prices need to increase by another 40% to allow suppliers to cross the breakeven point. Therefore, prices are expected to be quite strong in the coming quarters.

Read more

• NAND Flash Industry Revenue Grows 2.9% in 3Q23, Expected to Surge Over 20% in Q4, Says TrendForce
• [Insights] Memory Spot Price Update: Modest DRAM Increase; NAND Flash 512Gb Premium Fades

(Photo credit: Samsung)

With the successful mass production of TSMC’s 3nm process and preparations for the upcoming 2nm process, recent reports suggest that TSMC has awarded a special contribution bonus to its research and development team in December, acknowledging the hard work of its employees.

In response to the news about the special contribution bonuses in December, TSMC stated that the company has always upheld the belief that “employees are the company’s most important assets” and this move is part of the ongoing commitment to taking care of its workforce.

According to reports citing from the industry sources, TSMC successfully commenced production of 3nm chips last year, and mass production is on track for the latter half of this year. Following this, advancements are being made in advanced processes, including 2nm and the development of processes such as A14 (1.4nm) and A10.

Specifically, after smooth research and development trials of the 2nm process this year, it will be integrated into the completed construction of Fab 20 in Baoshan, Hsinchu. The team at this facility is gearing up for risk production in 2024 and aims for mass production in 2025. A14 is expected to undergo trial production and mass production between 2027 and 2028.

TSMC has previously mentioned in its Earning Conference that the 2nm process technology will adopt a Nanosheet transistor structure, enhancing performance to meet the growing demand for energy-efficient computing.

Additionally, the 2nm family has developed backside power rail solution, particularly suitable for high-speed computing applications. The goal is to launch this solution for customer adoption in the latter half of 2025 and begin mass production in 2026.

Read more

• TSMC Q323 Earnings Call Full Transcript: Question 1 to Question 5
• [News] TSMC’s 2nm Plan in Kaohsiung: Rumors of Constructing 5 Fabs

(Photo credit: TSMC)

Recently, the information cited by Sina Technology indicates that during a recent internal event at Xiaomi, executives from Xiaomi’s automotive division disclosed that the team currently comprises 3700 members. Reportedly, their ambitious goal is to create a Dream Car that can compete with renowned brands like Porsche and Tesla.

According to sources, Xiaomi’s Automotive Vice President and Political Commissar of the Beijing headquarters, Yu Liguo, shared in a recent internal event at Xiaomi, saying, “Mr. Lei (Lei Jun, Xiaomi CEO) often tells us that only those who understand and love cars can make good cars. I believe that among the 3,000-plus people in the automotive department, we have indeed found a group of people who truly understand and love cars.”

Yu further stated that the Xiaomi Automotive Division, established nearly three years ago, currently consists of 3,700 individuals from diverse backgrounds, all sharing a common dream – to create a Dream Car that can rival Porsche and Tesla.

Reportedly, Yu also mentioned that in certain scenarios while driving, Xiaomi’s autonomous driving tests have achieved success, surpassing the current capabilities of Tesla. Although these conditions may not be typical for autonomous driving, they reflect the capabilities of autonomous driving.

On the other hand, Lei Jun further emphasized the importance of corporate culture in the internal event. He stated that Xiaomi has clarified its goals for the new decade this year – to become the leader in the new generation of global hardcore technology. If Xiaomi is to succeed in the next decade, it must have a team capable of fighting tough battles.

He gave an example that in recent years, Xiaomi has rapidly assembled large teams, whether in the chip department or the automotive department, reaching scales of two to three thousand people in a very short time.

To quickly unite everyone as one force, is not only on strategy and motivation but also on corporate culture, which may not be visible in ordinary times, and it is only when facing difficulties, dangers, or situations that require responsibility that it can fully manifest itself.

Previously, Lei Jun announced that Xiaomi would hold a technology launch event for its car on December 28. Lei Jun revealed that the development of Xiaomi’s first car involved a total of 3,400 engineers, with the entire R&D investment exceeding CNY 10 billion. It is noteworthy that he emphasized this event would focus on technology and not product launches.

Looking at his recent teasers on Weibo, the autonomous driving technology mentioned by Yu Liguo is expected to be featured in the technology release. Additionally, there is anticipation for the debut of Xiaomi’s self-developed operating system, HyperOS, in the automotive context.

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• [News] Lei Jun States Xiaomi’s First Car Involves 3,400 Engineers with R&D Investment Exceeding RMB 10 Billion

(Photo credit: China’s Ministry of Industry and Information Technology)