China is reportedly in the process of establishing its third-phase of its big fund, with plans to inject USD 27 billion in funding aimed at supporting top-tier technology development, as per Bloomberg’s report. The goal is said to be enhancing China’s semiconductor self-sufficiency and overcoming export restriction measures imposed by the United States.

According to Bloomberg, the funding for the third phase of Big Fund primarily originates from local governments, state-owned enterprises, and their investment branches, with relatively smaller contributions from the central government. This aligns with China’s strategic focus on concentrating resources to support the development of key technologies.

The initial round of financing for the third phase of Big Fund aims to raise USD 27 billion, which, in the context of China’s semiconductor industry standards, is a relatively modest amount. The fund will directly support local companies and finance three to four sub-funds, diversifying transaction sources and investment strategies.

The National Integrated Circuit Industry Investment Fund, commonly referred to as the “Big Fund,” originated from the Chinese State Council’s “Outline for the Promotion of National Integrated Circuit Industry Development” issued in June 2014. Its ultimate goal is to bring China’s semiconductor industry up to international standards by 2030 and nurture a group of companies to become international Tier 1 suppliers.

As early as September of 2023, the second phase of the Big Fund initiated a round of financing, raising USD 41 billion to support local fab equipment manufacturers. As for the third phase of the Big Fund, this USD 27 billion will be allocated to critical projects across various regions in China.

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• [News] US Government Considers Adding ChangXin Memory Technologies to Entity List, Imposing Further Sanctions on Chinese Firms
• [News] Big Fund II Infuses HLMC with an Additional USD 1 Billion, Potentially Eyeing on More Advanced Processes

(Photo credit: iStock)

According to sources cited in Bloomberg’s report, the US government is considering imposing sanctions on Chinese technology firms, including ChangXin Memory Technologies (CXMT), in its latest move against China’s advanced semiconductor sector.

The same report has pointed out that the US Department of Commerce’s Bureau of Industry and Security (BIS) is currently considering including CXMT in the Entity List, which would restrict the listed companies’ access to US technology. Apart from CXMT, US officials are also contemplating restrictions on five other Chinese companies, though the final list has yet to be confirmed.

Regarding this matter, the BIS and White House National Security Council declined to comment.

CXMT is a major Chinese DRAM manufacturer whose products include chips applicable in computer servers, smart vehicles, and other devices. Its primary competitors include Micron, Samsung Electronics, and SK Hynix. Micron.

The recent actions by the US government reportedly stem from Huawei’s breakthrough last year in circumventing US restrictions to acquire advanced process chips, specifically obtaining chips using the 7-nanometer process from SMIC (Semiconductor Manufacturing International Corporation). This allowed Huawei to make a comeback in the 5G smartphone market, prompting concerns and responses from the US government.

Gina Raimondo, the US Secretary of Commerce, has responded by stating that the US will take “as strong and effective action as possible” to uphold national security interests.

Currently, companies that have been listed on the Entity List by the US Department of Commerce include Huawei, SMIC (Semiconductor Manufacturing International Corporation), and Shanghai Micro Electronics. Additionally, China’s other major memory manufacturer, Yangtze Memory Technology Corp, was added to this restriction list in 2022.

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• [News] Bypassing U.S. Restrictions? CXMT Showcases GAA Technology for 3nm Chips
• DRAM Industry Sees Nearly 30% Revenue Growth in 4Q23 Due to Rising Prices and Volume, Says TrendForce

(Photo credit: CXMT)

As per Chinese media mydrivers’ report, it has indicated that NVIDIA updated the EULA terms in the CUDA 11.6 installer, explicitly prohibiting third-party GPU companies from seamlessly integrating CUDA software. This move has reportedly stirred up discussions among the market.

NVIDIA updated the EULA agreement for CUDA 11.6, explicitly stating, “You may not reverse engineer, decompile or disassemble any portion of the output generated using SDK elements for the purpose of translating such output artifacts to target a non-NVIDIA platform.”

This move is reportedly speculated to target third-party projects like ZLUDA, involving Intel and AMD, as well as compatibility solutions from Chinese firms like Denglin Technology and MetaX Technology.

In response, MooreThreads issued an official statement, confirming that its MUSA and MUSIFY technologies remain unaffected. MUSA and MUSIFY are not subject to NVIDIA EULA terms, ensuring developers can use them with confidence.

In fact, since 2021, NVIDIA has prohibited other hardware platforms from running CUDA software analog layers but only warned about it in the online EULA user agreement. Currently, NVIDIA has not explicitly named any parties, issuing warnings in the agreement without taking further action, although further measures cannot be ruled out in the future.

In the past, CUDA development and its ecosystem were widely regarded as NVIDIA’s moat. However, processor architect Jim Keller previously criticized CUDA on the X platform, stating, “CUDA is a swamp, not a moat,” adding, “CUDA is not beautiful. It was built by piling on one thing at a time.”

Meanwhile, according to the account rgznai100 posting on Chinese blog CSDN, NVIDIA’s actions will have a significant impact on AI chip/GPGPU companies that previously adopted CUDA-compatible solutions. NVIDIA may initially resort to legal measures, such as lawsuits, against GPGPU companies following similar paths.

Therefore, Chinese enterprises should endeavor to enhance collaboration with the open-source community to establish an open AI compilation ecosystem, reducing the risks posed by NVIDIA’s market dominance.

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• [News] HBM Manufacturers Encounter Challenges in NVIDIA Quality Tests, Raising Concerns over Yield and Production
• [News] NVIDIA Reportedly Overwhelms TSMC with 3 and 4-Nanometer Orders

(Photo credit: NVIDIA)

As per the report from Bloomberg, the US government is set to invest USD 3.5 billion in Intel to enhance the production capacity of advanced chips for military and intelligence purposes. Reportedly, the move is potentially positioning Intel as a leading semiconductor provider in the defense market.

Under the US government’s RAMP-C initiative, numerous companies, including IBM, Microsoft, and NVIDIA, are developing chips for the US military. Stu Pann, Intel’s head of foundry, recently stated in an interview with Tom’s Hardware that the company has signed a USD 1 billion contract with the US government and the Department of Defense.

According to the same report from Tom’s Hardware, this funding could be part of the total appropriation of USD 39 billion under the CHIPS and Science Act or may stem from the proposed Secure Enclave program specifically designed for military and intelligence chips. In any case, it will strengthen Intel’s position as a leading manufacturer in the defense market.

As the new funding announcement emerges, the U.S. Department of Commerce is also poised to invest billions of dollars in leading chip manufacturers like Intel, Micron, Samsung, and others, aiming to enhance local semiconductor manufacturing capabilities.

The U.S. government enacted the “Chip Act” in 2022. For now, only three American companies currently benefiting from the subsidies, including BAE Systems, GlobalFoundries, and Microchip Technology.

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• [News] Announcement on Additional Subsidies for Chip Act Expected This Week; Intel Could Receive Billions

(Photo credit: Intel)

Earlier rumors have suggested that the Huawei P70 series smartphones would be unveiled in March. However, according to sources cited by IJIWEI, the P70 series is expected to be delayed until April. It is anticipated to include three models: the P70, P70 Pro, and P70 Art.

Based on information from Weibo and X-platform sources cited in IJIWEI’s report, the Huawei P70 series is expected to feature high-density lithium batteries, wireless charging, and satellite communication technology across all models. In terms of imaging, the series is expected to be equipped with periscope telephoto lenses and a 50MP main camera. The main camera’s CIS is expected to be either the Sony IMX989 or OV50H. The display is expected to have a 1.5K resolution and support LTPO technology.

The Huawei P series smartphones are known for their imaging capabilities. Leaks cited by the report suggest that the P70 will feature a 2.5D curved screen and BeiDou Navigation Satellite System. The model, expected to be the P70 Art, is rumored to adopt the IMX989 one-inch main camera sensor with support for a physically variable aperture.

The P70 Art will also include a 50-megapixel ultra-wide-angle camera and an upgraded 4X periscope telephoto module, as per the report. Additionally, the dual-directional satellite communication technology of this phone is expected to see upgrades.

Regarding the processors of the Huawei P70 series, reports suggest that they will adopt the same model as the Mate 60 series, although the flagship variant of the P70 may have a different processor frequency compared to the standard version.

The Huawei P70 series is expected to bring many highlights in terms of configuration, design, imaging performance, and more. However, specific details such as the release date and parameter information will require further confirmation from Huawei officials.

Previously, analyst Ming-Chi Kuo from Tianfeng International Securities indicated in a report that Huawei is expected to launch a new flagship series, the P70, in the first half of 2024. Benefiting from upgraded camera specifications and the adoption of the in-house designed Kirin chip, the shipment volume of the models under Huawei’s P70 series is expected to see significant growth in 2024 compared to the 4–5 million units of the models under the P60 series in 2023.

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• [News] Huawei, Honor, and Transsion Reportedly Estimate Active Smartphone Shipment Goals in 2024, Projecting an Additional 70-80 Million Units

(Photo credit: Huawei)