According to the expreview’s report, due to the surge in demand for AI applications and the market’s need for more powerful solutions, NVIDIA plans to shorten the release cycle of new products from the original 2 years to 1 year. Regarding its HBM partner, although validations for various samples are still in progress, market indications lean towards SK Hynix securing the ultimate HBM3e supply contract.

In a recent investor presentation, NVIDIA revealed its product roadmap, showcasing the data center plans for 2024 to 2025. The release time for the next-generation Blackwell architecture GPU has been moved up from Q4 2024 to the end of Q2 2024, with plans for the subsequent “X100” after its release in 2025.

Photo credit: NVIDIA

According to Business Korea, NVIDIA has already signed a prioritized supply agreement with SK Hynix for HBM3e, intended for the upcoming GPU B100.

While NVIDIA aims for a diversified supply chain, it has received HBM3e samples from Micron and Samsung for verification testing, and formal agreements are expected after successful validation. However, industry insiders anticipate that SK Hynix will likely secure the initial HBM3e supply contract, securing the largest share.

With this transaction, SK Hynix’s revenue for the fourth quarter of the 2023 fiscal year is poised to surpass KRW 10 trillion, marking a resurgence after a hiatus of 1 year and 3 months.

In the upcoming NVIDIA products scheduled for release next year, the newly added H200 and B100 will incorporate 6 and 8 HBM3e modules, respectively. As NVIDIA’s product line transitions to the next generation, the usage of HBM3e is expected to increase, contributing to SK Hynix’s profit potential.

SK Hynix is actively engaged in the development of HBM4, aiming to sustain its competitive edge by targeting completion by 2025.

TrendForce’s earlier research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. The progress of HBM3e, as outlined in the timeline below, shows that Micron provided its 8hi (24GB) samples to NVIDIA by the end of July, SK hynix in mid-August, and Samsung in early October.

Given the intricacy of the HBM verification process—estimated to take two quarters—TrendForce expects that some manufacturers might learn preliminary HBM3e results by the end of 2023. However, it’s generally anticipated that major manufacturers will have definite results by 1Q24. Notably, the outcomes will influence NVIDIA’s procurement decisions for 2024, as final evaluations are still underway.

(Photo credit: SK Hynix)

On December 1, the Ministry of Trade, Industry, and Energy (MOTIE) of South Korea disclosed that Korea’s export value in November experienced a notable YoY increase of 7.8 %, reaching a monthly peak for this year at USD 55.8 billion. Concurrently, imports contracted by 11.6 % to USD 52.0 billion, resulting in a trade surplus of USD 3.8 billion.

Semiconductors, ending a 15-month decline, exhibited growth of 12.9 %, attributed to the escalating fixed prices of memory chips. Anticipated releases of new smartphone models and AI server products are expected to fuel demand, sustaining the positive trend in exports.

The export value of automobiles surged by 21.5 % to USD 6.5 billion, marking the 17th consecutive month of growth. This was fueled by robust demand for high value-added vehicles, such as SUVs and eco-friendly cars, particularly in the U.S. market. On the other hand, Electric Vehicles (EVs), constituting 23.8 % of the total automobile export value, experienced a remarkable 69.4 % increase, reaching USD 1.6 billion.

In terms of regional performance, exports to six out of Korea’s nine major destinations achieved growth, with notable increases in exports to the U.S., ASEAN, Japan, Latin America, India, and the EU.

Exports to China, despite a marginal decrease of 0.2 % to USD 11.4 billion, reached unprecedented highs, surpassing USD 10 billion for the fourth consecutive month. For the U.S., the exports recorded double-digit growth for the second consecutive month, reaching USD 11.0 billion, driven by strong demand for automobiles, machinery, semiconductors, wireless communication devices, home appliances, petrochemicals, and bio-related products.

In terms of Asia, ASEAN witnessed an 8.7 % increase in exports to USD 9.8 billion, achieving the second-highest November monthly exports of all time across various sectors. Exports to Japan increased by 11.5 % to USD 2.6 billion, driven by growth in petroleum products and bio health despite a decline in steel exports.

On November 30th, Apple revealed an extension of its partnership with Amkor in the advanced packaging sector within the United States. Apple proudly proclaimed its role as the inaugural and principal client for Amkor’s recently established facility in Peoria, Arizona. In this collaboration, Amkor will handle the packaging of Apple chips manufactured at the nearby TSMC’s wafer fab. Worth noting, Apple is also TSMC’s leading customer at the Arizona fab.

Jeff Williams, Apple’s CEO, emphasized Apple’s unwavering commitment to American manufacturing, stating that they will continue expanding investments in the U.S. Apple silicon’s groundbreaking performance capabilities have enabled users to accomplish unprecedented tasks. The announcement highlights the anticipation of Apple silicon being manufactured and packaged in Arizona.

According to the press release, Apple and Amkor have been collaborating for over a decade, packaging chips extensively used in all Apple products. Concerning the new factory, Amkor will invest approximately $2 billion, and upon completion, it will employ over 2,000 people.

Apple also underscores that the investment in advanced manufacturing is part of the company’s commitment in 2021 to invest USD 430 billion in the U.S. economy over five years. Currently, Apple is working towards achieving this goal through direct spending with American suppliers, data center investments, U.S. capital expenditures, and other domestic expenditures.

On the other hand, Amkor outlined plans to establish a state-of-the-art manufacturing campus featuring an expansive 500,000 square feet of cleanroom space. The primary objective of the initial phase is to initiate production within the next two to three years.

Amkor aims to provide cutting-edge technology catering to high-volume semiconductor advanced packaging and testing, specifically supporting crucial markets such as high-performance computing, automotive, and communications. The newly proposed production facility will be strategically located within a semiconductor hub, surrounded by front-end wafer fabs, IDM, and existing or expanding suppliers in the field, including TSMC, Intel, Applied Materials, ASML, and others.

“Amkor has been a strategic OSAT partner to TSMC for many years,” said Dr. C.C. Wei, CEO of TSMC. “TSMC applauds Amkor for investing in the future of the semiconductor industry with us in Arizona. We share Amkor’s excitement for its significant investment and the value this facility will bring to TSMC, our customers, and the ecosystem.”

Giel Rutten, CEO from Amkor, indicated the incorporation of this new U.S. facility with Amkor’s advanced facilities across Asia and Europe serves to strengthen global extension and fosters both global and regional supply chains. Amkor’s investment is positioned to bolster them in advanced packaging and testing, concurrently reaffirming the commitment to expanding chip manufacturing in the United States.

According from the financial reports, Amkor’s two largest clients are Apple and Qualcomm. Apple accounted for 20.6% and Qualcomm 10.1%. of Amkor’s USD 7.1 billion in revenue last year.
(Image: Amkor)

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According to South Korean media The Elec’s report, due to strong demand from Chinese chip manufacturers and wafer foundries, the shortage of photomasks in the market has not eased, and it is anticipated that prices will rise in 2024.

The report notes that most photomask manufacturers, including Japan’s Toppan, DaiNippon Printing, and the U.S.’s Photronics, are currently operating at full capacity with a utilization rate of 100%. Some Chinese chip companies are even willing to pay additional fees to expedite delivery schedules.

In the field of integrated circuits, the function of a photomask is similar to the “film” in a traditional camera. With the collaboration of exposure and development processes in photolithography machines and photoresist, the pre-designed patterns on the photomask are transferred to the photoresist on the substrate, enabling mass production through image replication.

Photomasks play an indispensable role in the semiconductor chip manufacturing process, especially in advanced processes where more intricate circuit patterns require multiple layers of photomasks to aid production. For example, mature processes may require around 30 photomasks, while the latest advanced processes might demand as many as 70 to 80 photomasks to handle.

Currently, Chinese foundry giant SMIC employs Deep Ultraviolet (DUV) technology to produce 7nm chips. Compared to Extreme Ultraviolet (EUV), DUV requires more photomasks for the fabrication of multiple circuit patterns.

Toppan Printing, in its latest quarterly financial report covering July to September, anticipates a continual increase in demand for photomasks throughout 2023. DaiNippon Printing expressed agreement with this assessment in its half-year financial report for the period from April to September.

The graphic dimensions, precision, and manufacturing technology requirements of semiconductor photomasks continue to increase, with only a 3% domestication rate for high-end photomask versions in China. In the preparation of photomasks, the Chinese semiconductor photomask industry faces a situation where high-end equipment and materials are dominated by foreign manufacturers.

In the photomask industry chain, the upstream sector primarily involves equipment, substrates, light-blocking films, and chemical reagents; the midstream sector is photomask manufacturing, and the downstream sector includes chips, flat panel displays, touchscreens, circuit boards, and more.

The urgent demand for domestic substitutes for photomask versions is apparent, and the revenue scale of Chinese photomask manufacturers still has a considerable gap compared to leading overseas manufacturers.

(Photo credit: Toppan)

India could see at least three more semiconductor fabrication units coming up in the next few months with cumulative investments to the tune of USD 8-12 billion, Union Minister for Electronics and Information Technology Ashwini Vaishnaw said on Tuesday.

India is working hard to get big semiconductor companies to build chip plants in the country with its $10 billion semiconductor program. Global semiconductor giants are considering making factories in India driven by the need to diversify supply chains beyond China and the big demand for tech talents in India.

According to Deccan Herald’s report. At the unveiling of AMD’s global design center in Bengaluru on November 28th, Ashwini Vaishnaw, Union Cabinet Minister for Railways, Telecommunications, Electronics and Information Technology of India, briefed journalists on ongoing negotiations with several local governments to determine precise locations in the following months.

AMD’s global design center plans to host around 3,000 AMD engineers in the coming years, focused on the design and development of semiconductor technology including 3D stacking, artificial intelligence, machine learning, and more. Vaishnaw pointed out that AMD setting up its biggest design center is strong evidence of how much global companies trust India. Besides, Vaishnaw highlighted the achievement of Micron’s semiconductor plant project, which was revealed in June and started construction in September. He said the success of Micron’s initial facility in India has boosted confidence globally.

Apart from global giants’ investment in India, the minister also told about the Semiconductor Lab (SCL) progress in Mohali, mentioned significant headway in the Expression of Interest (EoI) process. He anticipates finalizing matters within the next 5-6 months. The lab is planned to serve as both a research and semi-commercial facility.

The Indian government asserts that a comprehensive microprocessor chip manufacturing initiative is on the horizon in the country. Anil Agarwal, Chairman of Vedanta, anticipates the launch of “Vedanta chips made in India” by 2025, reported by icbank on weixin.

The government envisions establishing a “semiconductor city” in Dholera, Gujarat, covering an area equivalent to Singapore, with Prime Minister Modi expressing confidence in attracting both domestic and international giants to set up manufacturing plants despite the remote location.

The tech hub in Bangalore has played a pivotal role in India’s ascent as a global participant in the semiconductor network, primarily through chip design. Over the past two years, substantial government subsidies have transformed India into a hub for electronic product manufacturing.

India’s Challenges abound in the Actual Chips Manufacture

Despite initiatives like the “production-linked incentive measures” encouraging mobile assembly in India since 2020, chip manufacturing remains a formidable task.

Presently, nearly all cutting-edge chips are produced in Taiwan, with China’s chip investments surpassing those of India. Vedanta Group’s Agarwal plans to kickstart chip manufacturing within two and a half years, extending invitations to global chip manufacturing experts.

While today’s cutting-edge chips are predominantly manufactured in Taiwan, TSMC has even established a fab in Arizona with the assistance of the U.S. “Chip Act.”

India lacks a historical presence in chip manufacturing and faces a shortage of highly skilled engineers and equipment. Nevertheless, the government aims to achieve what companies like TSMC took decades to accomplish through substantial spending and capital investment promotion. However, China’s significant investments in domestic chip manufacturers, following the U.S. ban tightening China’s semiconductor development last October, far exceed India’s investments in local companies.

With the goal of establishing India’s inaugural semiconductor foundry, Mr. Agarwal of Vedanta Group aims to commence chip manufacturing within two and a half years, extending invitations to international talents like David Reed and Texas Instruments.

Agarwal aspires to attract around 300 foreign experts from East Asia and Europe to Gujarat. The manufacturing of microchips also necessitates a significant amount of customized infrastructure, with Vrishno, the responsible official, indicating that India’s largest chemical plant near Dholera can produce the specialized gases and liquids required for any chip factory’s operation.
(Image: AMD India)