SK Hynix has updated its latest timeline regarding HBM4E, the company’s 7th generation high bandwidth memory, on Monday. According to reports from Wccftech and TheElec, the memory heavyweight’s generation changes of two-year gap has been shortened to one, and is now on track to launch HBM4E by 2...

TrendForce’s latest findings revealed that as of 2024, Taiwan is expected to lead the global semiconductor foundry capacity in advanced manufacturing processes (including 16/14nm and more advanced technologies) with a 66% market share, followed by Korea (11%), US (10%), and China (9%). However, th...

SoftBank Group's global IP leader, Arm, has reportedly announced the establishment of an AI chip division with the goal of developing AI chip prototypes by spring 2025. According to a report from DRAMeXchange, mass production will be handled by contract manufacturers, with initial production slated ...

Industry sources cited by a report from Economic Daily News have indicated that Apple is accelerating the development of its foldable device, moving up the expected launch from 2026 to 2025. Apple has reportedly placed orders for flexible panels from Samsung, with plans for the foldable device to de...

According to a report from Korean media The Korea Economic Daily, Samsung Electronics Co. is planning to apply its 3nm process chips to its Galaxy series smartphones and smartwatches, posing a challenge to rivals Apple and TSMC. The report cited industry sources on May 13th, stating that Samsung'...