On April 24, Horizon Robotics, a Chinese autonomous driving solution provider,  officially released six chips of Horizon Journey™ 6 series, supporting low, medium, and high-scale intelligent driving applications. Among them, the Journey 6E/M chips feature computing power of 80 TOPS and 128 TOPS r...

According to a report from Korean media outlet viva100, Samsung has signed a new USD 3 billion agreement with processor giant AMD to supply HBM3e 12-layer DRAM for use in the Instinct MI350 series AI chips. Reportedly, Samsung has also agreed to purchase AMD GPUs in exchange for HBM products, althou...

To enhance the supply chain capabilities in Europe and strengthen outsourced backend manufacturing operations in the region, major automotive and power semiconductor manufacturer Infineon announced an expanded partnership with semiconductor packaging and testing services provider Amkor Techology. Ac...

The US-China tech conflict has extended to RISC-V chips. Reuters reported on April 24th that the US Department of Commerce, in a letter dated around April 15th to members of Congress, highlighted concerns regarding China's involvement in open-source RISC-V chip technology. The Department of Comme...

TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanoshe...