According to a report from South Korean media outlet TheElec, Samsung's Advanced Package (AVP) team has reportedly secured an advanced packaging order for NVIDIA's AI chip, paving the way for future supply of NVIDIA's high-bandwidth memory (HBM) chips. The report, citing sources, reveals that Sa...

According to TechNews, TSMC announced its latest updates on the evening of the 5th, stating that equipment within its Taiwan wafer fabs has largely recovered. The company's full-year performance outlook, denominated in USD, is expected to remain consistent with the forecast provided during the Janua...

Taiwan experienced a magnitude 7.2 earthquake on the 3rd, prompting round-the-clock repair efforts during the holiday by semiconductor fabs, aiming to restore equipment operations. According to reports from TechNews, the latest progress of various fabs and science parks across different locations is...

On the morning of the 3rd April, a Richter scale 7.2 earthquake occurred, shaking the entire Taiwan. Semiconductor wafer foundries were also disrupted, and relevant manufacturers have carried out emergency evacuations according to SOP. According to Money DJ, in response to the earthquake impact, ...

DRAM Spot Market: The current decline in spot prices is also one of the reasons for TrendForce’s relatively conservative forecast. Spot prices have been falling for several weeks. Apart from weak channel demand, TrendForce has also observed that memory module manufacturers are experiencing a co...