Articles


2024-03-22

[News] Samsung Reportedly Commits to Advanced Packaging, Targets Over USD100 Million in Related Revenue This Year

Amid the AI boom driving a surge in demand for advanced packaging, South Korean semiconductor giant Samsung Electronics is aggressively entering the advanced packaging arena. On the 20th, it announced its ambitions to achieve record-high revenue in advanced packaging this year, aiming to surpass the...

2024-03-21

[News] MediaTek Partners with Ranovus to Enter Niche Market, Expands into Heterogeneous Integration Co-Packaged Optics Industry

MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This pla...

2024-03-21

[News] NVIDIA CEO Jensen Huang Estimates Blackwell Chip Price Around USD 30,000 to USD 40,000

With the Blackwell series chips making a splash in the market, pricing becomes a focal point. According to Commercial Times citing sources, Jensen Huang, the founder and CEO of NVIDIA, revealed in a recent interview that the price range for the Blackwell GPU is approximately USD 30,000 to USD 40,000...

2024-03-21

[News] US Considers Sanctioning Huawei-Linked Chinese Chip Network, Huawei-Related Enterprises Blacklisted

According to Bloomberg citing sources, the US government is considering adding Chinese semiconductor companies linked to Huawei to a blacklist. This move comes after Huawei made significant breakthroughs in technology last year, indicating a potential escalation in US efforts to curb China's ambitio...

2024-03-21

[News] Blackwell Enters the Scene – A Closer Look at TSMC’s CoWoS Branch

NVIDIA unveiled its Blackwell architecture and the touted powerhouse AI chip GB200 at GTC 2024 held in San Jose, California, on March 19th. Manufactured using TSMC's 4-nanometer (4NP) process, it is expected to ship later this year. According to a report from TechNews, TSMC's CoWoS technology com...

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