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2024-03-11

[News] NVIDIA’s EULA Amendments Tighten Grip, Suppressing Third-Party CUDA Emulation

As per Chinese media mydrivers’ report, it has indicated that NVIDIA updated the EULA terms in the CUDA 11.6 installer, explicitly prohibiting third-party GPU companies from seamlessly integrating CUDA software. This move has reportedly stirred up discussions among the market. NVIDIA updated th...

2024-03-08

[News] Intel Closer to Secure USD 3.5 Billion Investment from US Government for Chip Manufacturing in Military and Intelligence Applications

As per the report from Bloomberg, the US government is set to invest USD 3.5 billion in Intel to enhance the production capacity of advanced chips for military and intelligence purposes. Reportedly, the move is potentially positioning Intel as a leading semiconductor provider in the defense market. ...

2024-03-08

[News] Rumors Suggest Huawei P70 Series Release Delayed to April

Earlier rumors have suggested that the Huawei P70 series smartphones would be unveiled in March. However, according to sources cited by IJIWEI, the P70 series is expected to be delayed until April. It is anticipated to include three models: the P70, P70 Pro, and P70 Art. Based on information from...

2024-03-08

[News] Speculations Arise on Samsung’s Partnership with Meta, Potentially Tapping into TSMC’s Client Base

As Samsung's foundry business closely trails TSMC, Economic Daily News has reported that Samsung is poised to secure orders for Meta's next-gen AI chips, manufactured on a 2-nanometer process. If so, this may mark Samsung's first 2nm customer, intensifying the rivalry with TSMC in the 2nm race. A...

2024-03-08

[News] SK Hynix Reportedly Invests USD 1 Billion in Advanced Packaging to Strengthen HBM Chip Leadership

South Korean memory giant SK Hynix is significantly investing in advanced chip packaging, aiming to capture more demand for High Bandwidth Memory (HBM), a vital component driving the burgeoning AI market. According to Bloomberg's report, Lee Kang-Wook, currently leading SK Hynix's packaging res...

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