As semiconductor fabrication technologies continue to advance, the number of transistors in integrated circuits (ICs) has steadily increased. Initially, ICs contained only tens of transistors, but as technology progressed, ICs integrating hundreds of thousands of transistors enabled the realization of 3D animation. ICs with millions of transistors allowed computers to enter households, and today, ICs with hundreds of billions or even trillions of transistors enable digital technology to connect the entire world, profoundly impacting people’s lives.

Over the past 65 years, semiconductor fabrication processes have rapidly evolved, driven by Moore’s Law, gradually reshaping society. However, in recent years, semiconductor processes have approached physical limits, and the failure of Moore’s Law has been a topic of concern. In response, 3D IC stacking and heterogeneous integration technologies have emerged as promising solutions.

3D Stacking Trends

With the rapid development of applications such as AI, AR/VR, and 8K, a significant demand for computation is expected to continue, particularly driving parallel computing systems capable of handling vast amounts of data in a short time. As semiconductor processes slow down, 3D packaging has become an effective means to extend Moore’s Law and enhance IC computing performance.

3D packaging technology offers numerous advantages over traditional 2D packaging. It enables size reduction, with silicon interposer efficiency exceeding 100%, improved connectivity, reduced parasitic effects, lower power consumption, lower latency, and higher operating frequencies. These advantages, along with various benefits of 3D integration and interconnection technologies, make 3D packaging a development direction pursued by major players in the industry.

imec’s Vision for 3D Technology

In the field of 3D stacking technology, imec (imec, the Belgian Interuniversity Microelectronics Centre) defines four categories of 3D integration solutions: 3D-SIP, 3D-SIC, 3D-SOC, and 3D-IC, each requiring different process solutions and 3D integration techniques. Eric Beyne, VP R&D, Director 3D System Integration Program at imec specifically notes that concerning 3D interconnection technology, the scope of 3D interconnection will extend from stack packaging below 1 millimeter (mm), such as Package-on-Package (POP), to below 100 nanometers (nm) with true 3D ICs using transistor stacking, surpassing an interconnect density of 108/mm².

imec identifies three key elements in 3D integration technology: Through-Silicon Via (TSV), die-to-die and die-to-wafer stacking and interconnection, and wafer-to-wafer bonding technology. Beyne points out that TSV miniaturization technology continues to evolve. However, regarding “interconnect gaps,” as TSVs further shrink, microbump technology may struggle to meet higher interconnection demands, making cu-cu hybrid bonding technology a focus of development.

▲The image shows imec’s 3D interconnect technology roadmap, illustrating that as packaging technology continues to advance, node sizes shrink, and density further increases in 3D packaging. (Source：ISSCC 2021)

3D-SIP

System-in-Package (SIP), a form of system-level packaging, connects multiple chips that undergo different fabrication processes and preliminary packaging using heterogeneous integration techniques, integrating them within the same packaging shell. 3D-SIP involves vertically stacking multiple SIP chips, including packaging interconnects, fan-out wafer-level packaging, and solder ball bonding.

▲The image on the left is a schematic diagram of 3D-SIP packaging, where the connection points on both sides of the PCB board link the chips that have undergone initial packaging from top to bottom. The image on the right is an actual product illustration. (Source：TrendTorce (Left)，ISSCC 2021(Right))

Currently, the connection pitch in existing solutions is approximately 400 micrometers (µm). imec’s research aims to increase the interconnectivity of such SIPs by 100 times, reducing connection pitch to 40 µm. Common applications of 3D-SIP packaging include RF FEMs, TWS Barbuds SoCs.

3D-SIC

The second category, 3D-SIC (Stacking IC), involves the stacking of individual chips on top of each other. 3D-SIC is achieved by stacking chips on an interposer or wafer, with the finished chips bonded to the top of the wafer. Chips are interconnected through TSVs and microbumps, with industry solutions achieving pitch sizes as small as 40 µm. The technology is applied to products like 3D-DRAM and logic chips, connected alongside optical I/O units on the interposer. Currently, 3D-SIC technology is widely used in High-Bandwidth Memory (HBM) manufacturing.

▲The image depicts a schematic diagram of 3D-SIC, which utilizes cu-cu hybrid bonding technology to connect the upper and lower layers of ICs. (Source:imec)

3D stacking packaging is leading the global semiconductor industry, and imec has outlined a development blueprint focused on reducing interconnection pitch and increasing contact density per unit area, positioning 3D stacking as a solution to continue Moore’s Law amid slowing semiconductor processes.

Explore More

• An In-Depth Explanation of Advanced Packaging Technology: CoWoS
• Intel and Samsung Join TSMC in Fierce Advanced Packaging Race
• Continuing Moore’s Law: Advanced Packaging Enters the 3D Stacked CPU/GPU Era
• Understanding Chiplets, SoC, and SiP: Why TSMC, Intel, Samsung Invest?

This article is from TechNews, a collaborative media partner of TrendForce.

(Photo credit: TSMC )

Source to UDN, the DRAM market has been buzzing with positive developments lately, and may get a chance to see an upturn by the end of the year. Among the key factors driving this optimism is the DDR5 specification DRAM, which is poised to capitalize on opportunities in AI servers and laptops next year, gradually increasing demand.

After more than a year of corrections, the DRAM market is finally showing signs of improvement. Major DRAM manufacturers like Samsung and SK Hynix are still reducing production capacity, but their focus is primarily on DDR4 specification DRAM. Industry sources suggest that Samsung, in response to the growing demand for DDR5 DRAM, is set to significantly ramp up DDR5 production in the fourth quarter of this year, anticipating strong order demand next year.

In fact, such as Intel and AMD are planning to introduce new platforms next year that will support DDR5 specification DRAM, indicating a gradual decline in DDR4 demand. Beyond the consumer market, the server market is expected to experience a substantial surge in DDR5 demand, driven by the imminent launch of Intel’s fifth-generation server platform, Emerald Rapids, which fully supports DDR5. As AI server demand gains momentum, DDR5 demand is poised to enter a high-growth phase.

(Source: https://money.udn.com/money/story/5612/7488629 ; Image credit: Micron)

Source to China Times, due to weak demand and inventory piling up, the prices of a key chemical raw material, lithium carbonate, have recently been on a declining trend. Since the launch of lithium carbonate futures on the mainland on July 21, in just over two months, the price of lithium has fallen by nearly 100,000 CNY, marking a 39% decrease. In late September, lithium carbonate futures prices briefly dropped below 150,000 CNY per ton, reaching 145,000 CNY, marking a new low since their introduction.

Market analysts suggest that the current price of lithium carbonate futures on the mainland is around 150,000 yuan per ton. In the short term, prices are susceptible to the impact of supply contraction. While there may be some upward momentum following the sharp decline, the strength of the rebound is limited.

According to STCN from China, in the spot market on October 4, the benchmark price for battery-grade lithium carbonate was 175,000 CNY per ton, showing a monthly decline of over 20% compared to the 224,000 CNY per ton at the beginning of September. The benchmark price for industrial-grade lithium carbonate on the same day was 161,000 CNY per ton, reflecting a decrease of 23.33% by MoM.

Ruida Futures stated that from a fundamental perspective, the current situation of relatively ample lithium carbonate supply has not changed for now. With the recovery of operating rates in 2Q23, demand has not met expectations, leading to the inventory kept piling up, and continuous price declines.

Despite facing sanctions from the United States, Huawei continues to advance its 5G technology by gradually reducing reliance on American components in its base stations. Meanwhile, the White House is rallying its allies to block the adoption of Huawei’s 5G equipment. However, these challenges haven’t deterred Huawei’s commitment to research and development.

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According to Taiwan’s Economic Daily, Hon Hai Precision Industry Co., also known as Foxconn, is set to begin mass production of its electric vehicle Model C in the fourth quarter. With electric vehicles offering higher profit margins compared to iPhone assembly, this move is expected to further boost Hon Hai’s profit margins and strengthen its overall profitability structure as it continues to pivot towards a higher proportion of higher-margin products.

Based on the Model C, developed by Hon Hai’s subsidiary Foxtron, the company is also working on the electric vehicle “n7” for its customer, Yulon Group’s Luxgen brand. It has already received pre-orders for approximately 25,000 units and plans to start mass production in the fourth quarter of this year, with gradual deliveries starting in January next year. The company is aiming to export these vehicles as early as 2025, contributing to Hon Hai’s electric vehicle business achievements and expanding its electric vehicle manufacturing footprint.

The Luxgen n7 electric vehicle will offer three different versions, all equipped with Level 2 advanced driver-assistance systems (ADAS). These three versions include the standard model with a range of 420 kilometers, the long-range version with a range of up to 700 kilometers, and the performance version, capable of accelerating from 0 to 100 kilometers per hour in under 3.8 seconds. The prices range from TWD 999,000 to TWD 1,299,000, making it the only pure electric vehicle priced below one million New Taiwan Dollars in the Taiwanese market.

(Photo credit: Luxgen)