With Apple’s Extended Reality (XR) headgear, Vision Pro, set to hit the market early next year, Samsung is reportedly making diligent preparations to unveil its own XR product.

According to a report from Pulse News, the English version of the Korean Daily Economic News website, data released by the United States Patent and Trademark Office (USPTO) on the 14th indicates that Samsung Display has recently filed for a new trademark, “Flex Magic,” sparking rumors that it is intended for Samsung’s next-generation XR headset.

Samsung Display mentioned in its application documents that the universal applications of its display panel include 3D Spectacles, Virtual Reality Headsets, Virtual Reality Goggles, and smart glasses. The company had also applied for the same trademark with the European Union Patent Office in November.

While filing a patent does not guarantee the release of a product, the South Korean industry believes that Samsung Electronics has made significant progress towards unveiling a new product.

Reportedly, industry insiders in South Korea reveal that Samsung has set a goal to launch an XR device early next year, potentially entering a new frontier in competition with Apple. Initially named “Galaxy Glass,” this device was originally scheduled for a later release next year.

In February of this year, Samsung Electronics officially announced its entry into the XR market in collaboration with Google and Qualcomm. It is expected that Samsung Electronics will handle hardware development, Google will manage software, and Qualcomm will provide chipsets specifically for the XR platform.

Reportedly, industry insiders in South Korea anticipate that its primary competitor, Apple’s Vision Pro, is expected to launch in the United States in March of next year, followed by expansion into other countries, with a starting price of USD 3,499.

Read more

• [News] TSMC’s CoWoS Demand Surges from NVIDIA, Apple, AMD, Broadcom, Marvell, Monthly Capacity Up 120% in 2024

Despite the uncertainties in the semiconductor market, there is still an intense global competition in the development of advanced semiconductor manufacturing processes. TSMC as one of the key players in the foundry industry is actively advancing its next-generation 2nm process. According to market rumors, the schedule for the first tool-in at Hsinchu Baoshan Fab and Kaohsiung Fab has been established, along with a finalized production capacity plan.

CNA has reported that TSMC’s 2nm process will be deployed in the Phase 2 Expansion Area of the Baoshan Site at the Hsinchu Science Park. The first tool-in is scheduled for April 2024. Industry sources have revealed that the initial production capacity for this process will be around 30,000 wafers per month, with mass production planned for the following year.

In addition, TSMC’s fab in Kaohsiung has notified equipment suppliers that this facility is set to begin in the third quarter of 2025. According to MoneyDJ, the pilot run is planned for the end of the same year, with the aim of achieving mass production in 2026. The Kaohsiung fab will adopt the N2P process, which is an enhanced version of the 2nm process with the backside power rail technology. The initial monthly production capacity is also expected to be around 30,000 wafers.

According to previous disclosures made by TSMC during financial calls, the company has developed a backside power rail solution for the N2 process, which is particularly suitable for high-performance computing (HPC) applications. This innovative technology is expected to boost speed by 10% to 12% and increase logic density by 10% to 15%. TSMC plans to introduce the backside power rail solution to customers in the latter half of 2025, with mass production scheduled for 2026. This timetable aligns with recent rumor circulating in the supply chain.

In addition to the latest progress on the N2P process, TSMC made an official announcement at the IEEE International Electron Devices Meeting (IEDM) on December 12th. Specifically, the company revealed its plans to introduce a 1.4nm process as the successor to the 2nm process. As reported by Tom’s Hardware, this new process, named A14, continues the naming convention from the 2nm process (A20). Production using the A14 process is anticipated to take place between 2027 and 2028.

(Image: TSMC)

Explore more

• [News] TSMC Responds to Rumors of New 1.4nm Fab
• [News] TSMC President Highlights 2024 Semiconductor Challenges While Envisioning Abundant AI Opportunities
• [News] TSMC May Reduce Next Year’s Capital Expenditure, Affecting Orders for Equipment & Testing-Related Companies

On December 13th, the Ministry of Trade, Industry, and Energy (MOTIE) of South Korea held a ceremony to celebrate the establishment of the public-private Mobility Charging Industry Convergence Alliance. During the ceremony, the South Korean government announced measures aimed at promoting the electric vehicle (EV) charging industry and providing support to charging station operators.

According to a news report from Businesskorea, the South Korean government revealed a target of capturing a 10% global market share for chargers made by Korean companies by 2030, a significant leap from the current 1%.

The South Korean government aims to acquire five key technologies by 2030 in the field of EV charging market. These include ultra-fast charging, wireless charging, charging robots, intelligent charging, and cybersecurity software for charging stations.

The ultimate objective is to foster the growth of at least five domestic charging pile manufacturers with a combined annual revenue exceeding KRW 50 billion (approximately USD 38.66 million). Additionally, the government wants to significantly increase South Korea’s global market share in the EV charging market from 1.2% last year to 10% by 2030.

To achieve this policy objective, MOTIE has established the public-private Mobility Charging Industry Convergence Alliance. This alliance consists of more than 40 companies and 20 organizations, encompassing charging pile manufacturers, component suppliers, charging service operators, as well as testing and certification organizations.

TrendForce anticipates that by 2026, the global tally of public charging stations will soar to 16 million, marking an impressive threefold increase from 2023 figure. Alongside this growth, the global ownership of new energy vehicles (NEVs), which include plug-in hybrid vehicles (PHEVs) and battery-electric vehicles (BEVs), is projected to surge to 96 million. This will result in a vehicle-to-charger ratio of 6:1, a significant decrease from the 10:1 ratio observed in 2021.

(Photo credit: Pixabay)

Read more

• Driven by Global Government Initiatives: A Surge in Public Charging Piles Expected—16 Million by 2026, Tripling 2023 Figures, Says TrendForce

Amid ongoing rumors about Huawei potentially establishing its own wafer fab, the company has remained relatively discreet, especially in light of the U.S. restrictions on the exportation of semiconductor technologies to China. However, recent developments suggest that there may be some truth to these rumors. According to a patent announcement from the China National Intellectual Property Administration (CNIPA), Huawei has applied for a patent related to wafer processing.

According to a report from Chinese media outlet JRJ on December 12th, Huawei Technologies Co., Ltd. has filed a patent application titled “Wafer Processing Device and Wafer Processing Method” under the public number CN117219552A with the CNIPA. The application date is listed as June 2022.

The patent abstract shows the embodiments disclosure related to devices and methods for wafer processing. The wafer processing device comprises a wafer stage rotated along a rotation axis, a mechanical arm with a robotic hand for handling wafers and placing them on the wafer stage, a controller, and a calibration component. The calibration component includes a grating plate, fixed relative to the wafer stage; a light source, fixed relative to the grating plate; and an imaging element, fixedly provided on the mechanical arm, and adapted to receive light emitted from the light source and transmitted through the grating plate; wherein , the controller is configured to control the mechanical arm or the adjustment device on the mechanical arm to adjust the position of the wafer based on the detection of the received light by the imaging element;wherein, when the wafer stage carries the wafer, the grating plate and the imaging element are respectively located on opposite sides of the table where the upper surface of the wafer stage is located, and the upper surface is used to carry the wafer. The devices and methods provided by embodiments of the present disclosure can improve wafer alignment efficiency and alignment accuracy.

Earlier reports have suggested that Huawei is involved in the construction of wafer fabs in China. According to a news report from Bloomberg, Huawei is actively contributing to the expansion of at least three wafer fabs in the country. In its pursuit of building a self-sustaining semiconductor network, Huawei has acquired manufacturing facilities from Jinhua Integrated Circuit (JHICC) and Qingdao Aristocrat (Suppoly). Additionally, the company has assisted in the establishment of production facilities operated by Pengxinwei (PXW) and Shenzhen Pengsheng Technology (PST). It is worth noting that JHICC and PXW face challenges in selling their products to multinational corporations and encounter difficulties in procuring advanced wafer manufacturing equipment due to being blacklisted by the U.S. government.

(Image: Huawei)

Explore more

• [Insights] Chinese Government Invests in Huawei Supply Chain; Semiconductor Self-sufficiency for China’s Long-Term Growth

According to a news report from IJIWEI, sources have revealed that NVIDIA has placed urgent orders with TSMC for the production of AI GPU destined for China. These orders fall under the category of “Super Hot Run” (SHR), with plans to commence fulfillment in the first quarter of 2024.

Respond to the United States implementing stricter export controls on the Chinese semiconductor industry, sources stated in the report indicate that NVIDIA plans to provide a new “specialized” AI chip to China by lowering specifications, replacing the export-restricted H800, A800, and L40S series.

Insiders suggest that NVIDIA intends to resume supplying the RTX 4090 chip to China in January of next year but also release a modified version later to comply with U.S. export restrictions. 

On the other hand, NVIDIA continues to increase its orders with TSMC. This move aims to secure TSMC’s manufacturing capacity to meet the demand for the H100. However, due to limitations in CoWoS (Chip-on-Wafer-on-Substrate) production capacity, the H100 GPU is currently facing severe shortages.

It is noted that following NVIDIA, Intel and AMD are also expected to tailor AI chips for China. TSMC, as the primary pure-play foundry partner for these AI chip suppliers, will continue to enjoy a competitive advantage.

According to sources from semiconductor equipment manufacturers, despite TSMC’s efforts to increase CoWoS production capacity, the foundry still cannot meet the growing demand for NVIDIA GPUs. Additionally, the MI300 chip that was recently launched by AMD is also competing for the foundry industry’s production capacity.

Insiders note that TSMC’s ability to expand CoWoS production capacity is limited, with delays in equipment replacement speed, machine installation speed, and labor deployment. The new capacity is expected to be ready by the second quarter of 2024.

Equipment is identified as one of the key variables affecting TSMC’s expansion of CoWoS production capacity. Unexpected impacts on production and delivery times from Japanese equipment supplier Shibaura have delayed the development and installation of new capacity across TSMC’s production lines, including those in Longtan and Zhunan.

TSMC Chairman Mark Liu mentioned in a press conference in September that the shortage of CoWoS packaging capacity at TSMC is temporary, and it will be addressed through capacity expansion within the next year and a half to meet the growing demand.

(Photo credit: TSMC)

Read more

• [News] TSMC’s CoWoS Demand Surges from NVIDIA, Apple, AMD, Broadcom, Marvell, Monthly Capacity Up 120% in 2024