In a bid to enhance its foundry capabilities, Samsung is earnestly integrating hybrid bonding technology. According to industry sources, Applied Materials and Besi Semiconductor are establishing equipment for hybrid bonding at the Cheonan Campus, slated for use in next-generation packaging solutions...

TrendForce has released the latest panel quotations for early February. Due to the effective production control strategies implemented by panel manufacturers, there is an expectation of gradually stimulating panel demand. It is anticipated that TV panel prices will return to an upward trend in Febru...

India's Tata Group is reportedly in discussions with Taiwanese electronics manufacturer Pegatron to establish a joint venture, with the intention of co-managing the Apple iPhone assembly plant currently under construction in the southern state of Tamil Nadu. The partnership is anticipated to hasten...

"Foldable Phones" have emerged as the new epitome of high-end flagship smartphones. However, whether it's in the form of vertical or horizontal folding, it may no longer meet the needs of some users. Recently, industry sources cited by TechNews has suggested that Chinese smartphone brand Huawei i...

During the "SEMICON Korea 2024" event held recently in Seoul, Chun-hwan Kim, Vice President of global memory giant SK hynix, revealed that the company's HBM3e has entered mass production, with plans to commence large-scale production of HBM4 in 2026. According to a report from Business Korea, Chu...