In recent market speculations, TSMC is rumored to have reduced its 8-inch wafer manufacturing quotes by as much as 30%, with subsequent reports suggesting that South Korean wafer foundries are following suit in lowering 8-inch wafer production prices.

According to TrendForce’s channel check, TSMC’s current strategy for 8-inch processes involves bundling spot deal negotiations with one-time pricing or offering discounts and rebates on initial NRE fees, without implementing an across-the-board price cut.

However, observations from the order books indicate a genuine decline in demand for 8-inch products. Presently, customers have started revising their orders through the first quarter of 2024. The possibility of TSMC reducing prices for 8-inch wafers cannot be ruled out.

Similarly, the industry has also seen reports of South Korean wafer foundries Samsung and Dongbu HiTek considering price reductions for their 8-inch wafer plants. TrendForce indicates that the price adjustments in South Korea’s 8-inch wafer foundries follow a similar pattern of spot deal reductions, primarily centered around one-time negotiations. Customers with long-term agreement already have lower prices, without any instances of price reduction.

Both 12-inch and 8-inch wafer fabrication utilization rates have shown less-than-expected recovery, leading TrendForce to estimate a year-on-year decrease of around 13% in the overall semiconductor foundry revenue for 2023.

(Photo credit: TSMC)

According to a report by Taiwan’s Commercial Times, global smartphone brands are set to introduce a series of flagship-level new products. Following the introduction of Apple’s A17 chip using TSMC’s 3-nanometer process, Qualcomm’s next-generation processor Snapdragon 8 Gen 3 and MediaTek’s Dimensity 9300 are expected to be unveiled in October. These chips will be manufactured using TSMC’s N4P process, with plans to further transition to the N3E process next year.

Industry source have indicated that TSMC’s 3-nanometer yield is gradually improving, coupled with the return of N4P orders, providing a counterbalance against the impact of sluggish end market demand.

Commercial Times’ report highlights that TSMC previously expressed strong demand for its N3 process, projecting substantial growth in the second half of the year. The N3 process will support high-performance computing (HPC) and smartphone platforms, with an anticipated contribution of 4-6% to the company’s revenue in 2023. Additionally, N3E has already been verified and received its first batch of customer product design approvals, with mass production expected to commence in the fourth quarter. TSMC aims to achieve a monthly production capacity of 100,000 wafers in its 3-nanometer process by the end of the year to cater to Apple’s demands.

According to Bloomberg’s recent exposure of Apple’s projected M3 processor product roadmap set for release this fall, the basic M3 processor consists of 4 high-performance and 4 energy-efficient cores, paired with 10 GPU cores. M3 Pro comes in two versions: a basic version equipped with 12 cores (6 high-performance and 6 energy-efficient) and 18 GPU cores, and a higher-tier version with 14 CPU cores and 20 GPU cores.

M3 Max also offers two versions, featuring a fully-equipped 16-core CPU. The main difference between the basic and higher-tier versions lies in the GPU cores—32 for the former and a whopping 40 for the latter. The most powerful variant, M3 Ultra, essentially doubles the configuration of M3 Max, boasting 32 CPU cores paired with either 64 or 80 GPU cores. Industry experts widely regard TSMC as the primary beneficiary of these developments.

(Photo credit: TSMC)

According to a report by Taiwan’s Economic Daily, Google has notified Chromebook manufacturers to start collecting licensing fees from July 1st, prompting laptop brands to accelerate shipments ahead of schedule. As a result of this “urgent order,” Taiwan’s contract manufacturers achieved better-than-expected results in Q2.

In a press release dated July 3rd, TrendForce noted that Google’s formal imposition of Chromebook licensing fees is bound to affect the competitiveness of Chromebooks in the entry-level market. However, laptop brands, in order to avoid incurring additional costs due to licensing fees, are actively advancing Chromebook shipments regardless of having a clear grasp of end-demand orders. This enthusiasm has driven overall Chromebook shipment performance in the second quarter.

TrendForce mentioned that after a seven-quarter adjustment period, education tender orders from North America, Indonesia, and India have begun to emerge for Chromebooks. Additionally, with assistance from the United Nations Children’s Fund, Ukraine’s educational reconstruction needs have also gradually emerged. Nevertheless, due to the off-peak season for Chromebooks in the latter half of the year and the impact of licensing fees, demand is expected to remain subdued compared to the first half.

Furthermore, according to TrendForce’s insights, following Google’s formal initiation of licensing fees, the ODM production costs for consumer-grade Chromebooks have risen by $6 to $8, while business-grade laptops have experienced an increase of $7 to $12. However, considering the stagnation in end-demand this year, brand manufacturers have yet to make any adjustments to end-user pricing.

(Photo credit: Google)

Intel Corporation today announced that it has mutually agreed with Tower Semiconductor to terminate its previously disclosed agreement  to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022. In accordance with the terms of the merger agreement and in connection with its termination, Intel will pay a termination fee of $353 million to Tower.

In response to this development, TrendForce provides the following analysis:

As previously mentioned by TrendForce, Intel’s active entry into the semiconductor foundry market has presented challenges. These include:

Diversification of Manufacturing Expertise: Intel, historically focused on manufacturing CPUs, GPUs, FPGAs, and peripheral I/O chips, lacks the specialized fabrication processes possessed by other foundries. The success of acquiring Tower to expand its product line and market presence remains crucial.

Operational Segmentation: Apart from financial divisions, the division of physical facilities and actual production capacity must be strategically managed. Successfully emulating models like AMD/GlobalFoundries or Samsung LSI/Samsung Foundry, where there is a clear distinction between foundry and client, is essential. Simultaneously, Intel faces challenges in preventing orders from its significant client, the Intel Design Department, from flowing outward.

The official termination of the Tower acquisition plan introduces greater uncertainties and challenges for Intel in the competitive foundry market. In an industry marked by heightened competition, having dominance in specialized process technologies and diversified production lines is pivotal for sustaining profitability amid industry downturns. Without the assistance of Tower’s established specialized processes, Intel’s strategic approach and technology development in the foundry business will be worth monitoring.

(Photo credit: Intel)

According to a report from Ijiwei, a China-based media, industry insiders have revealed that Taiwanese display driver IC (DDI) suppliers are considering shifting their chip manufacturing to China due to cost considerations, as the prices offered by chip foundries there are significantly lower than those in Taiwan.

Almost all DDI suppliers are feeling substantial pressure to reduce the prices of display driver chips in the latter half of 2023. Industry sources state that while the touch and display driver integration (TDDI) chips for smartphone screens have nearly reached cost parity, the prolonged slump in the smartphone market has led display panel customers to shift the pressure upstream along the supply chain.

The downward pricing pressure on display driver chips isn’t confined to the smartphone sector alone. Medium and large panel customers in segments like TVs and automotive displays are also requesting more substantial discounts from DDI manufacturers. However, the pressure from these sectors is somewhat less pronounced than that from the smartphone sector.

(Photo credit: Transsion)