According to a report by Taiwan’s Economic Daily, the revival of the smartphone market has fallen short of expectations. Industry sources have indicated that in order to stimulate customer demand and expedite inventory clearance, Qualcomm has recently initiated a price war, targeting mid- to- low-range 5G smartphone chips. The price reduction is substantial, ranging from 10% to 20%. It is anticipated that Qualcomm’s price reduction strategy will extend into the fourth quarter.

The consumer electronics market began to slump in the fourth quarter of last year. Downstream inventory levels began to visibly dissipate in the first half of this year, gradually returning to normal. There was optimism in the market that the Chinese smartphone market would improve in the second half of this year, and there were even reports of a slight resurgence in Qualcomm’s chip shipments during the second quarter.

However, even after China’s 618 shopping festival, the downturn in the consumer electronics market has not shown significant improvement. This has led to Qualcomm’s inventory levels rising to nearly two quarters’ worth.

With low order visibility and high inventory, the supply chain has reported that Qualcomm has recently decided to initiate a price war, primarily focusing on the mid- to low-range market segment. If the pace of inventory clearance falls short of expectations, there is a possibility of further intensifying the price reduction efforts.

Industry analysts suggest that Qualcomm’s extensive price cuts underscore the challenging situation in the mid- to low-range 5G smartphone market, where demand has been lackluster.

(Photo credit: Qualcomm)

As August arrives, the LED industry is once again witnessing price increases. Recently, 8 Chinese companies including MLS, Ruisheng Optoelectronics, Developer Microelectronics, Cailiang, BOE, and Skyworth announced adjustments in the prices of LED products. Among them, MLS, BOE, Skyworth, and Cailiang have already announced price hikes multiple times this year.

The price adjustments in August primarily cover lighting, display packaging, display driver ICs, display, and lighting products, with increases ranging from 5% to 15%.

Regarding the reasons for this round of price adjustments, all the manufacturers have cited continuous increases in upstream raw material prices. The cost of production remains disproportionate to the selling price of the products. In order to continue offering high-quality products and services and sustain the long-term health of the industry, the decision to raise product prices has been made.

(Photo credit: BOE)

According to the news from Taiwan tech media, TechNews, in a groundbreaking move, Samsung has unveiled its inaugural 110-inch Micro LED television, signaling a significant foray into the premium TV segment. Not to be outdone, competitor LG Display (LGD) is reportedly poised to make its own mark by launching a 136-inch Micro LED smart display next year, with initial applications targeted at theaters, indoor conference rooms, and other similar venues.

According to insider sources, LGD is gearing up for mass production of its impressive 136-inch Micro LED display, expected to commence around July of the upcoming year. The initial production goal is set at over 100 units, with deployment primarily earmarked for theaters, indoor conference facilities, and possibly large-scale corporate headquarters.

Notably, LGD’s ambitious 136-inch smart display project is a collaborative effort with Micro LED from Unikorn Semiconductor, which is a subsidiary under Ennostar. Unikorn emphasized the paramount significance of this partnership, affirming substantial breakthroughs in both quality and yield through their joint endeavors. By elaborating during a recent press conference, underlining the imminent production review phase scheduled for the third and fourth quarters – a pivotal juncture that could potentially elevate Micro LED’s contribution to Unikorn’s revenue to a significant proportion. Interestingly, this timeline harmonizes with LGD’s projected rollout of their Micro LED smart display.

But, Ennostar has no comment regarding this development, refraining from disclosing any customer-related particulars.

LGD is currently making assertive strides in the fiercely competitive Micro LED technology landscape. Notably, LGD recently acquired a set of 14 U.S. patents related to Micro LED technology from Taiwanese firm Ultra Display Technology, according to reports from, The Elec, a South Korean media outlet. These patents encompass crucial transfer processes, underscoring LGD’s strategic approach.

Furthermore, whispers from the industry suggest that Apple’s extensive Micro LED transfer process for the Apple Watch could see a significant handover to LGD. This would entail LGD overseeing an integrated workflow, encompassing chip manufacturing, backplane assembly, and transfer processes, while Apple retains responsibility for device design and pivotal technical support. The anticipated mass production timeline for the Micro LED-equipped Apple Watch has been deferred to the first quarter of 2026, a delay likely attributed to the recalibration of the production supply chain.

(Photo credit: LGD)

Major economies are investing heavily in semiconductor industries, with China leading at $143 billion, the U.S. at $52.7 billion, and the EU at $47 billion, according to “EE Times”. India plans to give $922 million amid U.S.-China tensions.

Despite China’s much larger subsidies compared to India’s, the Chinese semiconductor industry faces various challenges. But under mainly from the United States, to slow down its progress, some Chinese companies are struggling to survive, while others are shutting down. For instance, after OPPO’s unexpected announcement in May to close their IC design company ZEKU, active for less than 4 years, Holding Group, Geely, also declared on August 8th that it would halt its self-developed chip business through the Xingji Meizu group, only 5 months after its launch.

According to a recent report from ‘EE Times,’ governments from around the world are actively pursuing semiconductor self-sufficiency to meet their high-tech and communication needs. China, in particular, has taken the lead by planning a substantial $143 billion subsidy program to boost its industry and reduce dependence on the United States.

In the U.S., the ‘Chips ACT’ passed last year allocated $52.7 billion in subsidies. As per McKinsey, the cumulative commercial investments related to this endeavor have already exceeded $200 billion.

The European Union is also making its mark, aiming to increase its global semiconductor market share from 10% to 20% by 2030. The ‘European Chips Act’ is expected to see $47 billion in government investment. TSMC has confirmed plans to establish a factory in Germany and is expected to receive relevant subsidies.

Singapore is projecting a $19 billion subsidy for its semiconductor industry, while Japan’s exact subsidy scale remains unknown, with reports suggesting a minimum of $6.5 billion. South Korea is focusing on tax reductions for semiconductor-related companies, offering 15% tax credits for corporate groups and up to 25% for small and medium-sized enterprises.

Recently, the UK and India have joined the battle. The UK has set aside a $1.5 billion subsidy, and India’s ‘Semicon India’ initiative offers at least $922 million to bolster its influence in the global electronics supply chain. While Malaysia hasn’t disclosed the amount of support for its chip industry, the country is providing approved priority industries, especially high-tech firms, with a full 10-year tax exemption. The government also offers investment subsidies and various incentives within specific investment zones.

Amidst U.S. restrictions, China initially aimed to boost its chip industry and create its own ‘China chips.’ However, setbacks have occurred. OPPO’s IC design company, ZEKU, formed in 2019, spent a staggering $44 billion over three years only to shut down on May 12th, leaving 3,000 employees jobless. Geely Holding Group’s subsidiary, Xingji Meizu, also announced on August 8th their decision to halt self-developed chip operations due to global economic uncertainties. Their focus will now turn to product innovation and software user experiences.

(Source: https://ec.ltn.com.tw/article/breakingnews/4392195)

As semiconductor process technology nears known physical limits, the spotlight among major industry players is shifting towards the development of advanced packaging. Concurrently, the rise of applications like artificial intelligence and AIGC has propelled the concept of advanced packaging into a new technological wave. In the midst of the semiconductor industry’s global competition, securing more orders has become a core objective for major players.

A Competitive Landscape in Advanced Packaging

The competition in advanced packaging technology is intensifying, with companies pouring substantial investments into the field, resulting in a landscape of vigorous competition. Various packaging technologies have emerged, with notable offerings from industry giants such as TSMC, Intel, and Samsung.

TSMC introduced 3DFabric, an integration of its TSMC-SoIC front-end technology with CoWoS and InFO back-end technologies, providing maximum flexibility for diverse innovative product designs.

Intel, on the other hand, features its 2.5D EMIB and 3D Foveros packaging technologies. EMIB is applied in the connection of logic chips and high-bandwidth memory, as seen in the Intel Xeon Max series and Intel Data Center GPU Max series.

Foveros allows top dies to overcome size limitations and accommodate more top and base dies, connected through copper pillars to reduce potential interference from through-silicon vias (TSVs).

Samsung also exhibits strong competitiveness in advanced packaging, with its 2.5D I-Cube4 and H-Cube, along with 3D X-Cube packaging technologies, achieving breakthroughs in multi-chip interconnects and integration.

Samsung’s I-Cube4, for example, integrates four HBM stack dies and one core compute IC on the silicon interposer layer, while H-Cube enhances packaging area through the stacking of HDI PCBs to accommodate designs with six or more HBM stack dies.

Advantages of the Three Giants

In recent years, the three semiconductor giants have directed substantial capital expenditure towards advanced packaging. Their diverse technological developments and marketing strategies are poised to ignite a global battle in the semiconductor advanced packaging industry.

TSMC holds the advantage with its dominant wafer process technology and an end-to-end comprehensive service approach. Coupled with Taiwan’s robust semiconductor ecosystem, TSMC leads the way in the advanced packaging domain.

Intel, while slightly trailing TSMC in advanced process technology, matches it in advanced packaging capabilities. Emphasizing flexible foundry services, Intel allows clients to mix and match its wafer manufacturing and packaging offerings. With manufacturing facilities scattered worldwide, Intel leverages geographic advantages, particularly in Western countries, to expand capacity and services, leading to anticipated gains in the future.

Samsung, like TSMC, offers end-to-end services, but its packaging technology lags behind TSMC’s. It secures a share in constrained supply situations. Notably, Samsung, in June 2022, was ahead of TSMC in unveiling the innovative GAA 3nm process, and is poised to combine it with 3D packaging technology, potentially marking a pivotal point in the next semiconductor generation.

With semiconductor technology’s continuous evolution and surging market demand, the competition among the three giants in advanced packaging will remain fierce. While wafer fabs currently prioritize processes, the next three to five years are expected to witness a gradual shift towards advanced packaging. Different packaging technologies and marketing strategies will ultimately determine companies’ positions and influence in the market.

(Photo credit: TSMC)

Read more:

• An In-Depth Explanation of Advanced Packaging Technology: CoWoS
• ASE, Amkor, UMC and Samsung Getting a Slice of the CoWoS Market from AI Chips, Challenging TSMC