According to TechNews, AUO held a board meeting and signed a contract with PlayNitride on October 31st. The deal entails PlayNitride assisting AUO in setting up a cutting-edge 6-inch Micro LED Chip on Carrier (CoC) production line at AUO’s Longtan Tech Park facility, offering an all-in-one solution. The contract is valued at a substantial 700 million NT dollars, with a duration of 30 months.

The CoC production line is a pivotal part of Micro LED manufacturing, and AUO emphasizes that this contract is distinct from the one they have with Ennostar.

AUO highlights that their partnership with PlayNitride in establishing the CoC production line not only puts them in control of the most vital raw materials for Micro LED but also enables them to bring CoC to Micro LED module production in-house. This strategic move is expected to significantly enhance production efficiency, increase yield rates, and bolster AUO’s competitiveness in terms of Micro LED product costs. This, in turn, accelerates the timeline for the mass commercialization of Micro LED.

AUO’s involvement in Micro LED research dates back to 2012, resulting in expertise in display technology and manufacturing processes. In the display industry, they’ve been integrating the supply chain and establishing a comprehensive Micro LED ecosystem, gradually working toward the goal of commercialization during the year of mass production for Micro LED. AUO has big plans for applying Micro LED display technology across various fields.

Addressing concerns about technology transfer, PlayNitride clarifies that technology transfer primarily pertains to well-established product technologies, carried out incrementally with different firms. At the same time, PlayNitride is committed to developing new processes and products, and with patent protection in place and specific company considerations, there’s currently no need to fret about any technology leakage.
In August this year, TrendForce predicted rapid growth in the Micro LED chip market, with an expected value of $27 million in 2023, marking a 92% YoY increase. This growth is expected to continue, reaching approximately $580 million in 2027, with a CAGR of about 136% from 2022 to 2027. AUO, known for LCDs, has already produced the world’s first 1.39-inch Micro LED watch panel. Major companies, including AUO’s current client Tag Heuer, are potential adopters of Micro LED wearable devices.
(Image: AUO)

Explore more:

• Japanese Watchmakers and Western Automakers Boost Micro LED Market to Near US$600 Million by 2027, Says TrendForce

Since October, China’s National Integrated Circuit Industry Investment Fund Phase II (hereafter referred to as “Big Fund Phase II”) has made two significant investments.

First, it invested in JCET Group’s subsidiary, JCET Group Automotive Electronics (Shanghai) Co., Ltd. (hereafter referred to as “JCET Automotive Electronics”). Later, it invested in ChangXin Xinqiao Storage Technology Co., Ltd. (hereafter referred to as “ChangXin Xinqiao”).

Data reveals that since its establishment, Big Fund II has invested in nearly 40 companies, with a total investment exceeding ¥55 billion. Despite the semiconductor industry’s low point this year, Big Fund Phase II has remained active, particularly emphasizing “strengthening the supply chain.” This includes increasing investments in critical areas like semiconductor equipment and materials.

1. Investing in ChangXin Xinqiao, Enhancing Storage Manufacturing

On October 26th, Big Fund II invested ¥14.5 billion to acquire a 33.14% stake in ChangXin Xinqiao.

According to industry sources, Changxin Xinqiao is one of the projects developed as part of the ChangXin Memory Technologies (CXMT), a collaboration between Hefei Municipal Government, CXMT, Overseas Chinese Town Holdings Company, and NAURA Technology Group Co. in 2019.

As per previous public announcements, the total investment in the CXMT Semiconductor Manufacturing Base exceeds 220 billion yuan. The project is situated in the Hefei Airport Economic Demonstration Zone and primarily focuses on the Changxin Memory project, involving the development of the entire upstream and downstream industrial chain.

Among these initiatives, the Changxin 12-inch storage memory wafer manufacturing base stands out with a total investment of 150 billion yuan, making it the largest single industrial project investment in Anhui Province.

Additionally, according to information on Changxin Memory’s official website, their core product is DDR4 memory chips, which belong to the fourth generation of double data rate synchronous dynamic random-access memory (SDRAM).

2. Increasing Investment in JCET Group’s Subsidiary: Automotive Electronics Focus

On October 27th, JCET Group’s subsidiary, JCET Group Automotive Electronics, received a total capital injection of 4.4 billion yuan from a combination of new and existing shareholders, further emphasizing its commitment to the development of in-vehicle technology. This infusion of capital will accelerate the construction of its first-phase project for manufacturing and testing automotive chips.

After this capital injection, the subsidiary’s registered capital increased from ¥400 million to ¥4.8 billion, remaining a subsidiary of JCET Group. JCET Group Management’s ownership will be diluted to 55%, while Big Fund Phase II will hold an 18% stake.

JCET Group stated that this capital injection is primarily intended for the construction and operation of the target company, aligning with the company’s strategic plans and business development requirements.It aims to better serve the continuously growing market and customer demands, especially in strengthening the company’s automotive electronics business.

Currently, the company’s financial health is robust, and it believes that this capital infusion will not significantly impact its liquidity.

3. Big Fund Phase II Focuses on “Strengthening and Supplementing the Supply Chain” and Plays a Significant Role in the Down Cycle

The semiconductor industry has experienced significant performance fluctuations due to the ongoing semiconductor down cycle. In response to these challenges, Big Fund Phase II has become more active.

The fund has appeared on the shareholder lists of multiple semiconductor companies striving for initial public offerings (IPOs), including Hua Hong Semiconductor Limited, RYCHIP Semiconductor Inc., Guanggang Gases & Energy Company Limited, and Sinophorus Electronic Materials Co..

Notably, Big Fund Phase II has shown continued interest in Hua Hong Semiconductor Limited.

Hua Hong Semiconductor 

Silan Microelectronics Co.

Silan Microelectronics Co. has also attracted significant attention from Big Fund Phase II. On August 28th, Silan Microelectronics announced its intention to jointly invest 1.2 billion RMB with affiliated company Big Fund Phase II and non-affiliated entity HaiChuang Development Fund to subscribe for newly increased registered capital of 1.19 billion RMB in the affiliated joint-stock company, Xiamen Silan Advanced Compound Semiconductor Co., Ltd.. Silan Microelectronics is set to acquire controlling interest in Xiamen Silan Advanced Compound Semiconductor, while Big Fund Phase II will hold a 14.11% stake.

Publicly available information indicates that Xiamen Silan Advanced Compound Semiconductor revolves around the manufacture of compound semiconductor chips. In July of the previous year, the company initiated the “SiC Power Device Production Line Construction Project.”

This project entails an investment plan of 1.5 billion RMB to construct a 6-inch SiC power device chip production line. Ultimately, it aims to achieve an annual production capacity of 144,000 pieces of 6-inch SiC power device chips, comprising 120,000 pieces/year of SiC-MOSFET chips and 24,000 pieces/year of SiC-SBD chips.

China Resources Microelectronics Limited

On August 15, it was announced that the company’s subsidiary, Runpeng Semiconductor, plans to increase capital and introduce external investors, including Big Fund Phase II. Following the completion of this transaction, Runpeng Semiconductor’s registered capital will increase from 2.4 billion RMB to 15 billion RMB.

The announcement indicates that the external investors that Runpeng Semiconductor intends to introduce include 12 institutions, including Big Fund Phase II. Big Fund Phase II is committed to subscribing to a registered capital of 3.75 billion RMB.

In addition, the upstream semiconductor materials sector has also attracted the attention of Big Fund Phase II. In late March of this year, Jingrui announced that its subsidiary, Hubei Jingrui, plans to introduce strategic investors through capital expansion. Big Fund Phase II, among others, is set to inject 160 million yuan in cash into Hubei Jingrui.

Summary

Overall, Big Fund Phase II’s investments span the entire integrated circuit industry chain. However, it’s worth noting that compared to Big Fund Phase I, Big Fund Phase II places more emphasis on strengthening and supplementing the supply chain.

It has increased investments in critical areas such as upstream semiconductor equipment, materials, and shows optimism towards emerging hot sectors like AI and automotive electronics.

(Photo credit: Pixabay)

On October 30th, major memory manufacturer Western Digital unveiled its financial results for the first quarter of 2024. During this quarter, the company achieved revenue of $2.75 billion, marking a 3% increase compared to the previous quarter but a 26% decrease compared to the same period last year.

The Potential for Sustained Growth in the Cloud Market

Taking a closer look at end-market dynamics in this quarter, flash memory prices continued to decline, but a surge in product shipments drove quarterly growth in specific business segments.

Western Digital’s cloud business revenue was $872 million, accounting for 32% of total revenue, with a 12% quarterly decrease and a significant 52% annual drop. On client revenue, revenue reached $1.147 billion, comprising 42% of total revenue, showing an 11% quarterly growth but a 7% annual decrease. Consumer revenue stood at $731 million, constituting 26% of total revenue, with a 14% quarterly increase and an 8% annual increase.

Looking forward, Western Digital expects its Q2F24 to range from $2.85 billion to $3.05 billion.

Western Digital’s CEO, David Goeckeler, credited the Q1F24 to the team’s dedication. He said, “Our ability to develop differentiated and innovative products across a broad range of end markets has resulted in sequential margin improvement across both flash and HDD businesses.”

Goeckeler also noted that consumer and client markets continue to perform well, and the cloud market is expected to sustain growth. As market conditions improve, Western Digital’s refined cost structure empowers the company to leverage enhanced profitability.

Data from TrendForce, as of September 12th, places Western Digital fourth in the global NAND Flash market for Q2 2023, with a market share of 14.7%. This positions the company closely behind industry giants like Samsung Electronics, Kioxia, and SK Group.

Regarding the merger with Kioxia, media reports suggest that Western Digital, following stalled negotiations, plans to divest its flash memory business, accompanied by a new round of financing to address part of its debt. This strategic separation allows the company to maintain its traditional hard drive business and create two distinct publicly traded entities.

Goeckeler also explained, “However, given current constraints, it has become clearer to the board in recent weeks that delivering a stand-alone separation is the right next step in the evolution of Western Digital.”

Is the Storage Industry Poised for a Revival?

The storage industry has been facing a period of stagnation due to economic challenges and sluggish demand in the consumer electronics sector. Major players in the storage market, including Western Digital, Micron, Samsung, and Kioxia, have been compelled to reduce production and investments to address the issue of oversupply.

However, recent reports indicate that memory chip prices are set to experience a significant upturn in the fourth quarter of the challenging year 2023. Experts suggest that the industry is gradually moving towards a phase of growth.

In terms of pricing, TrendForce forecasts a general price increase in both DRAM and NAND Flash products, starting in the Q4. For DRAM, a seasonal price increase of approximately 3-8% is expected. The sustainability of this upward trend will depend on suppliers’ commitment to production reduction strategies and the extent of demand recovery, particularly in the general server domain.

As for NAND Flash, TrendForce anticipates a comprehensive price increase of around 8-13% in the fourth quarter. Looking forward to 2024, the continuation of this upward trend for NAND Flash may face challenges unless original manufacturers maintain production reduction strategies and demand for Enterprise SSDs in the server domain experiences a revival.
(Image: Western Digital)

Explore more:

• NAND Flash and DRAM Spot Prices Upward in Late September, DRAM Price Stabilizes until Year-End
• Q2 NAND Flash Revenue Up 7.4%, Anticipated to Exceed 3% Growth in Q3, Says TrendForce
• NAND Flash Prices Expected to Stabilize and Rebound in Q4, Projected to Remain Steady or Increase 0-5%, Says TrendForce

Xiaomi’s subsidiary, Shanghai Xiaomi Jingming Technology Co., Ltd., was established recently with a registered capital of 10 million yuan (RMB). The company’s scope of operations includes car sales, car wash services, vehicle repair and maintenance, small and micro passenger car rental services, chauffeur services, and internet sales.

The establishment of this new company is closely tied to Xiaomi’s foray into the electric vehicle (EV) industry.

On March 30, 2021, during a Xiaomi product launch event, the company’s founder, Lei Jun, announced Xiaomi’s entry into the smart electric vehicle sector. Following this announcement, Xiaomi formally approved the EV project and committed to setting up a wholly-owned subsidiary to oversee its EV business. Xiaomi allocated an initial investment of 10 billion RMB for this venture, with a projected investment of 10 billion USD over the next decade.

In a recent development, Xiaomi’s Chairman, Lei Jun, expressed his optimism about Xiaomi’s electric vehicle project on October 25, stating that the project is progressing smoothly.

Sources familiar with the matter disclosed that Xiaomi’s electric vehicle project has multiple platform generations in development, with the first platform set for release in 2024 and the second in 2025.

Read more

•  [News] Xiaomi EV Reportedly Finalizes Battery Supplier List, CALB and CATL Chosen
• [News] Xiaomi Begins Trial Production of 50 Prototype Cars per Week

(Photo credit: Xiaomi’s Facebook)

Powerchip Semiconductor Manufacturing (PSMC), SBI Holdings, Inc., Japan’s Miyagi Prefecture and JSMC signed the Memorandum of Understanding on the 31st, confirming that JSMC’s first fab will be selected in Japan. The Second Northern Sendai Central Industrial Park in Ohira Village, Kurokawa District, Miyagi Prefecture (Second Northern Sendai Central Industrial Park) is the planned site.

It is understood that in August this year, PSMC and SBI jointly established JSMC and began preparations for setting up a wafer fab in Japan. After extensive discussions with the municipal government of the candidate locations and multiple on-site inspections, a number of factors were taken into consideration, including: the robustness of infrastructure such as water supply, drainage, high-voltage power supply, and logistics capabilities, as well as the park’s ability to withstand natural disasters, and surrounding life.

PSMC states that the quality of the environment and the potential for future industry-university cooperation ultimately led to the selection of the Second Northern Sendai Central Industrial Park as the site.

PSMC said that SBI is committed to working closely with the Japanese government, Miyagi Prefecture, partners and relevant financial institutions to discuss various details of investment in Japan. More information will be announced after the details are finalized.

(Image: PSMC)