Search Results for: foldable

Taiwanese panel company Innolux have said to be involving in collaborating with leading global memory manufacturers. According to a report from the Economic Daily News, plans are underway to repurpose its 4th Plant in Tainan (5.5-generation LCD panel plant) for AI-related semiconductor applications, specifically targeting back-end packaging.

Sources cited in the report indicate that, based on the strategies of the top three global memory manufacturers, the partner in this collaboration is likely a memory manufacturer that already has a presence in Taiwan and seeks to expand its capacity there. Innolux’s advantage lies in its advanced panel-level fan-out packaging (FOPLP), which is poised to make a substantial impact in the AI field. However, these reports have not been confirmed by Innolux or any global memory giants.

Regarding the 4th Plant developments at Tainan, Innolux stated on June 16 that, based on flexible strategic planning principles, the company continues to optimize production configurations and enhance overall operational efficiency. Some production lines and products are being adjusted to streamline and strengthen the group’s layout and development.

The surge in AI demand has driven the need for advanced chip heterogenous integration and high-end packaging technologies to meet the high-performance application requirements of AI devices. Targeting these opportunities, Innolux has reportedly repurposed its Tainan 3.5-generation and 4-generation LCD panel production lines for semiconductor-related uses, including FOPLP and X-ray sensors.

Sources cited in the report also revealed that Innolux’s transformation efforts are making progress. After closing the 5.5-generation LCD panel production at the 4th Plant last year, the company has gradually reassigned staff to other facilities. To revitalize capacity and assets, Innolux has been in close contact with leading global memory manufacturers, aiming to develop AI-related applications.

Currently, the three major global memory manufacturers are actively developing high-bandwidth memory (HBM) for AI servers. South Korea’s SK Hynix is the most proactive in collaborating with Taiwanese companies. SK Hynix has partnered with TSMC to aggressively target the AI market. As per a report from Korean media outlet The Korea Herald,  SK Group Chairman Chey Tae-won recently visited TSMC Chairman C.C. Wei to ensure continued close cooperation on the next-generation HBM.

On the other hand, Micron has established memory production in Taiwan but does not yet have HBM capacity for AI servers in the region. Meanwhile, Samsung does not have direct AI cooperation with Taiwanese companies in the memory sector.

Sources cited in the report from Economic Daily News indicate that Innolux is engaging with one of these three major international memory manufacturers, focusing on new semiconductor applications. As Innolux is advancing into the promising glass substrate packaging business through panel-level fan-out packaging, this technology is expected to be combined with memory applications for AI development. Therefore, the developments at its 4th Plant in Tainan are receiving considerable attention.

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• [News] Samsung Reportedly to Challenge Apple/TSMC with 3nm Exynos W1000
• [News] MediaTek Announces 4nm Dimensity 7300 Series Chips, Supporting Foldable Devices

(Photo credit: Innolux)

According to a report by the Korean media outlet The Chosun Daily on June 16th, Samsung’s “Galaxy Tab S10” series tablets will be equipped with MediaTek’s Dimensity 9300+ application processor (AP) from Taiwan, marking the first instance of MediaTek’s AP being adopted by Samsung’s flagship tablet.

The report highlights that MediaTek’s APs have primarily been used in Samsung’s mid-to-low-end smartphones. The decision to use MediaTek’s AP in the Galaxy Tab S10 series, instead of Qualcomm’s or Samsung’s own APs, is a significant shift for Samsung.

The sources cited in the report believe that Samsung’s move is a butterfly effect caused by TSMC’s price hikes. TSMC’s price increases have potentially led to a rise in the cost of Qualcomm’s Snapdragon chips, which are manufactured by TSMC. After price negotiations, Samsung’s Mobile Communications Business (MX) decided to equip the Snapdragon 8 Gen 3 chips only in the Galaxy Tab S10 Ultra series, while using MediaTek’s Dimensity chips in the Plus and base models.

The same report further indicates that from Samsung’s perspective, choosing Dimensity to reduce costs and diversify the supply chain is a sensible decision. However, for Samsung’s foundry division which manufactures Exynos, this development is somehow unwelcome. While Exynos used to have price advantages over Snapdragon in supplying Samsung’s flagship products, the use of Dimensity jeopardizes Exynos’ competitive edge in its bargaining power for future flagship product pricing negotiations.

Samsung Electronics’ upcoming AP, the “Exynos 2500,” set for release next year, will also face similar challenges. With TSMC recently rumored to increase price for its 3nm process, costs for Qualcomm’s Snapdragon 8 Gen 4, slated for release in October, are expected to sharply increase. Industry source cited by the report further suggests the cost of this chip could rise from over USD 200 in the previous generation to more than USD 250.

TSMC Chairman C.C. Wei recently stated that, almost all companies interested in AI-related demand are willing to work with TSMC. From the yield rates obtained by customers, TSMC offers the best cost-effectiveness solutions, hence there is room for price increases. Per a report from Liberty Times, the wafer order prices for TSMC in 2025 are expected to be finalized in September and October this year.

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• [News] Samsung Reportedly to Challenge Apple/TSMC with 3nm Exynos W1000
• [News] MediaTek Announces 4nm Dimensity 7300 Series Chips, Supporting Foldable Devices

(Photo credit: MediaTek)

According to sources cited in a report from Reuters, it’s said that IC design giant MediaTek is developing an ARM-based PC chip that will run Microsoft’s Windows operating system.

Last month, Microsoft unveiled a new generation of laptops featuring ARM-based chips, which provide sufficient computing power to run AI applications. Its executives stated that this represents the future trend of consumer computing. MediaTek’s latest development of an ARM-based PC chip is said to be geared toward these types of laptops.

The same report indicates that Microsoft’s move plans to take aim at Apple, which has been using ARM-based chips in its Mac computers for about four years. Microsoft’s decision to optimize Windows using ARM-based chips could further pose a threat to Intel’s long-standing dominance in the PC market.

Regarding this matter, both MediaTek and Microsoft declined to comment.

Reportedly, according to industry sources, MediaTek’s PC chip is scheduled to launch by the end of next year, coinciding with the expiration of Qualcomm’s exclusive agreement to supply chips for laptops. MediaTek’s chip, based on ARM’s existing designs, will significantly accelerate the development process by less design work.

It is currently unclear whether Microsoft has approved MediaTek’s PC chip for supporting the Copilot+ feature in Windows programs.

ARM executives have stated that one of their clients used ready-made components to complete a chip design in about nine months, although this client was not MediaTek. For experienced chip designers, creating and testing advanced chips typically takes more than a year, depending on the complexity.

In the latest press release from TrendForce, MediaTek’s strategy in the PC domain is also highlighted. Reportedly, the Arm chip co-developed by MediaTek and NVIDIA, with adoption of Wi-Fi 7 and 5G, is also slated to occupy a spot in the AI NB market since 2Q25, and initiate a new wave of technical innovation after 2025. According to TrendForce’s forecast, Arm chips are likely to surpass 20% in market penetration at an accelerated velocity in 2025.

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• [News] MediaTek Reportedly Partners with Meta, Entering the Battleground of AI against Apple and Qualcomm
• [News] MediaTek Announces 4nm Dimensity 7300 Series Chips, Supporting Foldable Devices

(Photo credit: MediaTek)

MediaTek is making further strides in AI applications, focusing on the integration of smartphones and AR/MR devices. According to a report from the Economic Daily News, they look to capitalize on the significant business opportunities presented by 3D imaging combined with generative AI for immersive experiences. The sources cited in the same report indicated that MediaTek has formed an alliance with Meta, leveraging MediaTek’s Dimensity series smartphone chips as a platform alongside Meta’s Quest devices to target this market.

Previously, tech giants like Apple and Qualcomm have also recognized the potential of 3D imaging combined with generative AI for immersive experiences, and thus have been actively developing their strategies. While Apple builds its ecosystem through iPhones and Vision Pro headsets, Qualcomm has strengthened its collaboration with Google. With Meta and MediaTek entering the fray, the competition in the 3D imaging market will be further intensified.

Industry sources cited by the same report indicated that the generative AI business opportunity is set to explode, as cloud service providers (CSPs) are actively building AI servers, engaging in a “computing power war.” This hints that future AI market demand is likely to extend from the cloud to edge devices, thereby expanding AI applications to smartphones and AR/MR-related end-user devices.

Apple, which just showcased its upcoming products at WWDC, has launched the MR device Vision Pro previously, and is reportedly looking to expand its AI technology layout further. This includes integrating AI capabilities into iOS 18 in the iPhone 16 series, which will be released in September.

Meanwhile, per the same report, it’s expected that the iPhone 16 series will significantly enhance 3D photography features and improve integration with the Vision Pro. This indicates that 3D imaging will become a new application frontier in Apple’s AI strategy.

Non-Apple camps are also sensing these trends and opportunities. Qualcomm is reportedly teaming up with Google to integrate related systems in smartphones and wearable devices.

It is reported that Google has already strengthened its hardware development team in Taiwan. By doing so, the tech giant is possibly aiming to collaborate directly with major semiconductor companies like TSMC to develop 3D imaging applications. To bolster its future AI strategy, Qualcomm will collaborate with Google to integrate 3D imaging platforms into smartphones.

Industry sources cited by the report suggested that beyond language models, imaging is one of the AI applications that provide tangible experiences for users. Currently, AI applications in imaging are mostly focused on photo editing and cartoonization. However, with the improvement of camera functionalities in mobile devices, AI will begin to be integrated into 3D imaging.

As a result, major mobile platform providers will not only emphasize AI processing chips in their future hardware specifications but also upgrade imaging hardware specifications. This is expected to become a new battleground, potentially sparking a new wave of AI-driven smartphone upgrades.

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• [News] Four Semiconductor Applicants for Taiwan’s Chip Act Tax Incentives – TSMC and MediaTek Expected to Benefit
• [News] MediaTek Announces 4nm Dimensity 7300 Series Chips, Supporting Foldable Devices

(Photo credit: MediaTek)

From May 14th to 16th, the international display industry’s leading event, SID Display Week 2024, was held in San Jose, USA. Major panel manufacturers such as BOE, TCL CSOT, Tianma, Visionox, Innolux, AUO, Samsung Display, and LG Display showcased a variety of new technological products. TrendForce will review and summarize the development focuses of various panel manufacturers from a technical perspective.

• 3D Display Makes a Comeback, Focusing on Glasses-Free Immersive Experience

3D visual perception is currently the most intuitive way humans perceive the world. Compared to AR/VR, which requires additional wearable devices, glasses-free 3D technology allows users to enjoy a lifelike visual experience without the need for glasses or headsets.

With significant improvements in display quality and user experience, this technology can now be applied to museum exhibits, outdoor advertising, medical education, and more. It has the potential to compete with emerging head-mounted devices in the future.

At the exhibition, in addition to 2D/3D switching, there were light-field displays that enhanced monocular resolution to retinal levels. Coupled with facial tracking and active human-machine interaction systems, these displays expanded the viewing range and 3D viewing angles, delivering an immersive and impressive desktop 3D display experience.

BOE: 110”16K 3D Display & 32”Light Field Display

LGD: Micro OLED+ Light Field Display

• Performance – Enhancing Efficiency to Meet AI Era Demands for Improved Image Quality and Reduced Power Consumption

Addressing the power consumption issues brought about by enhanced image quality can be achieved through various technological advancements such as pixel design, tandem architecture, AI intelligence, micro-lens arrays, oxide backplanes, and dynamic refresh rates. These innovations aim to improve image quality while simultaneously reducing power consumption.

For instance, oxide backplanes have significantly lower leakage currents compared to LTPS backplanes. Combined with new circuit designs, they can maintain voltage for extended periods, keeping flicker within a certain frequency during low-frequency refreshes. Dynamic refresh rates allow the screen’s refresh rate to adapt based on the content displayed, aligning refresh rates with display signals in real-time to provide longer battery life.

With the rapid development of artificial intelligence, AI technologies are being leveraged to enhance image quality while reducing screen power consumption (AI low-power image enhancement technology). The deep integration of AI with screens enables real-time image processing at high resolutions and refresh rates, reducing the power consumption of panel modules and achieving an optimal balance between reduced power consumption and improved image quality.

BOE: AIoT + OLED AI Power Reduction Technology

• Folding – Diversified Folding Designs Expanding Application Scenarios

At the exhibition, panel manufacturers showcased the durability of foldable screens through tests involving robots randomly striking the displays, demonstrating that foldable screens can now meet the demands of most usage scenarios.

In addition to the conventional inward and outward folding screens already available on the market, the exhibition also featured G/Z-shaped tri-fold phones and new foldable plus extendable display panels, allowing users to switch between different screen sizes based on application needs.

The introduction of various flexible display forms includes innovations such as the removal of polarizers, simplified hinges, and stress-designed screens, preparing for a variety of user experiences and interaction modes with the new foldable display panels. These complex module designs are expected to drive technological innovation within the supply chain.

SDC: Foldable OLED Reliability Test

SDC: Flex Note Extendable (Folding+ Sliding) Display Size: 13.8” -> 17.3”

SDC: Flex S Multi Foldable Display (Z-Shaped)

• Transparent Displays – Enhanced Transparency Technology for Better Integration with Environments

Once a futuristic display technology with a sci-fi aura, transparent displays are now being gradually applied in commercial, automotive, and everyday scenarios by various brands. Transparent displays transform glass from a mere transparent material into a display product with vast imaginative potential and rich content.

The key to enhancing screen transparency lies not only in the transparency of the substrate but also in effectively increasing the pixel aperture ratio to maintain image quality. Historically, Micro LED screens have achieved transparency rates of over 60%, while OLED screens have been around 40%. With recent technological improvements, the OLED screens showcased at this exhibition have now reached a 60% transparency level, matching that of Micro LED screens.

The future of transparent displays will be shaped by continued advancements in transparency, image quality, brightness, price, and product positioning. Higher transparency levels will enable seamless integration with environments, facilitating broader application and adoption of this innovative display technology.

Visionox: 10” Transparent OLED (Transparency: 60%)

AUO: 60” Transparent Micro-LED Display (Transparency: 60%)

• New Applications and Technological Breakthroughs

At the exhibition, notable breakthroughs in new applications and technologies included innovative automotive display designs, QDEL displays produced through printing processes, and high-brightness RGB OLEDos. Samsung Display and TCL CSOT both showcased QDEL-related technologies, employing printing methods to add quantum dots that directly convert light into colored images.

In traditional QLED technology, the light source is blue backlight that passes through quantum dots for color conversion. In contrast, the QDEL displays exhibited by Samsung Display and TCL CSOT apply current directly to the quantum dots to generate light. As a result, QDEL pixels can emit light and switch off independently, offering the same deep blacks and rich contrast as OLEDs.

Looking ahead, as the lifespan of the quantum dot light-emitting layer improves, QDEL is poised to become a competitive choice for consumer displays due to its lower cost and superior image quality.

Samsung: 18.2” QD-LED

BOE: P0.3 Micro LED Transformer Display Cluster <-> Center Information Display (CID)  Co-Driver Display (CDD)

TIMANA: 12.3”InvisiVue Display With Textured, Mini-LED

Visionox: Rollable OLED Surface Display

• Green Low-Carbon Technology Industry Development Trends

It is noteworthy that LG Display has focused on developing new technologies under the theme of a better future. BOE, in particular, has set up a green low-carbon zone at the center of their booth, highlighting green manufacturing, green product technology, and green supply chains.

They continue to lead the display industry with technological innovation and green development, promoting the healthy and sustainable growth of the global display industry.

BOE: Green for Future