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TrendForce’s latest research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung’s HBM3 (24GB) is anticipated to complete verification with NVIDIA by December this year. The progress of HBM3e, as outlined in the timeline below, shows that Micron provided its 8hi (24GB) samples to NVIDIA by the end of July, SK hynix in mid-August, and Samsung in early October.
Despite strong shipments of NVIDIA’s high-end GPUs—and the rapid introduction of compliant products such as the H20, L20, and L2—Chinese cloud operators are still in the testing phase, making substantial revenue contributions to NVIDIA unlikely in Q4. Gradual shipments increases are expected from the first quarter of 2024.
TrendForce reports that global demand for MLCCs is set to experience a period of slow growth from 2023 to 2024. With limited opportunities for industry growth, the demand for MLCCs in 2023 is estimated to be around 4.193 trillion units, with a modest annual growth rate of about 3%.
TrendForce has issued its latest findings, indicating that the global SSD market has rectified its supply and demand dynamics in 2022, following a resolution in the shortage of master control ICs that had hampered the market in 2021. Despite the normalization of supply, global SSD shipments witnessed a decline, with only 114 million units shipped in 2022—a 10.7% decrease from the prior year.
TrendForce data showcases that as of 2Q23, Taiwanese firms collectively command a hefty 65% market share in global foundry revenue, with TSMC alone claiming a whopping 56%. This underscores Taiwan’s crucial position globally and has motivated regions worldwide to establish semiconductor industries within their territories while considering a multitude of factors.
