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According to DRAMeXchange, a research division of TrendForce, as a result of weak PC demand, the DRAM contract price trend...
According to DRAMeXchange, a research division of TrendForce, the DRAM contract price...
According to DRAMeXchange, a research division of TrendForce, 2HMay 4GB module price...
According to DRAMeXchange, a research division of TrendForce, as DRAM makers hope contract price...
On May 8, Elpida revealed Micron as the winner of bidding for the right to negotiate exclusively to buy the Japanese DRAM maker. Three major DRAM teams are emerging in the industry - after Micron and Elpida have integrated, their combined market share will bring the Micron team’s figure (Micron, Inotera, Elpida, and Rexchip) to nearly 24%, surpassing SK Hynix’s 23.9% to become second only to memory giant Samsung.The tri-national alliance will combine the strengths of each – Micron’s flash products, Elpida’s mobile DRAM, and the Taiwanese makers’ manufacturing skills – presenting a formidable opponent to the Korean heavyweights. The DRAM industry is officially headed towards becoming an oligopolistic market with three major players dominating the industry. This will help DRAM chip price gradually return to a healthy state, and the competitive price-slashing will be a thing of the past...
According to DRAMeXchange, a research division of TrendForce, benefitting from the stabilization of commodity DRAM price as well as the fact that this quarter’s ASP decline was smaller than last quarter’s and bit growth increased due to capacity utilization rate recovery and technology migration, the DRAM industry saw healthy revenue figures in 1Q12, compared to the first quarter of years past – total DRAM revenue fell by a mere 2.8% QoQ in 1Q12...
According to DRAMeXchange, a research division of TrendForce, 4GB and 2GB module contract price...
According to DRAMeXchange, a research division of TrendForce, According to DRAMeXchange, a research division of TrendForce, as buyers and vendors have been in...
According to DRAMeXchange, a research division of TrendForce, DRAM contract price...
In June 2011, Intel’s Executive Vice President Sean Maloney introduced the chipmaker’s new Ultrabook concept at the annual Computex tradeshow in Taipei, revealing the chipmaker’s future plans for notebook product design. Intel asserted that Ultrabooks would bring about a new user experience with features such as “Always On, Always Connected” (AOAC), thin and light form factor, over 10 hours of battery life, ample performance, etc...
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