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TrendForce reports that the HBM (High Bandwidth Memory) market's dominant product for 2023 is HBM2e, employed by the NVIDIA A100/A800, AMD MI200, and most CSPs' (Cloud Service Providers) self-developed accelerator chips. As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year.
TrendForce reports that MLCC suppliers are also experiencing a resurgence, with their monthly average BB ratio—a key market indicator—rising from 0.84 in April to 0.91 in early July. In tandem, total shipment volume saw a remarkable 12% growth, climbing from 345 billion units in March to 389 billion units in June.
TrendForce reports that the problematic model currently experiencing issues is the SPR MCC 32-Cores. The majority of affected customers are concentrated in the corporate sector, prompting Intel to proactively halt shipments of SPR MCC SKUs. Fortunately, other models such as the 20/24C and 36C and higher remain unaffected.
TrendForce predicts that NAND Flash wafers will be the first to see a price hike in 3Q23 as prices for module products such as SSDs, eMMCs, and UFS will likely continue to fall due to tepid downstream demand. Consequently, the overall ASP of NAND Flash is forecast to continue dropping by about 3~8% in 3Q23, though a possibility exists prices may recover in 4Q23.
TrendForce anticipates the market share of Chinese foundries in terms of 12-inch wafer production capacity will likely increase from 24% in 2022 to an estimated 26% in 2026. Moreover, if the exports of 40/28nm equipment eventually receive approval, there’s a chance that this market share could expand even further, possibly reaching 28% by 2026. This growth potential should not be dismissed.