TrendForce reports that following the new U.S. export restrictions announced in April—which require additional permits for the export of NVIDIA’s H20 or any chips with equivalent memory bandwidth or interconnect performance to China—NVIDIA is expected to release a special low-power, downscaled version of the RTX PRO 6000 (formerly B40) for the Chinese market. This model will reportedly switch from the originally planned HBM memory to GDDR7, with a potential market debut as early as the second half of 2025.
TrendForce’s latest investigations reveal that continued AI investments by major North American CSPs are expected to drive a significant increase in enterprise SSD demand in the third quarter of 2025. The enterprise SSD market is likely to shift toward undersupply with finished product inventory levels remaining low, supporting a potential price increase of up to 10% QoQ.
TrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.
TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation. While ASE holdings and Amkor maintained leading positions, OSAT providers from China, such as JCET and HT-Tech, saw strong double-digit revenue growth—supported by government policies and domestic demand—posing a growing challenge to the existing market order.
