TrendForce predicts that NAND Flash wafers will be the first to see a price hike in 3Q23 as prices for module products such as SSDs, eMMCs, and UFS will likely continue to fall due to tepid downstream demand. Consequently, the overall ASP of NAND Flash is forecast to continue dropping by about 3~8% in 3Q23, though a possibility exists prices may recover in 4Q23.
TrendForce anticipates the market share of Chinese foundries in terms of 12-inch wafer production capacity will likely increase from 24% in 2022 to an estimated 26% in 2026. Moreover, if the exports of 40/28nm equipment eventually receive approval, there’s a chance that this market share could expand even further, possibly reaching 28% by 2026. This growth potential should not be dismissed.
TrendForce：2023 SiC Power Device Market Analysis Report
TrendForce reports that continued production cuts by DRAM suppliers have led to a gradual quarterly decrease in overall DRAM supply. Seasonal demand, on the other hand, is helping to mitigate inventory pressure on suppliers. TrendForce projects that the third quarter will see the ASP for DRAM converging towards a 0~5% decline.
TrendForce forecasts that global demand for HBM will experience almost 60% growth annually in 2023, reaching 290 million GB, with a further 30% growth in 2024.
