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NAND Flash demand continues to rise as strong sales of notebook (laptop) computers spur PC OEMs to place additional orders for client SSDs, according to TrendForce’s latest investigations. Also, the supply-side inventory for NAND Flash memory has already fallen considerably due to the aggressive stock-up activities of some smartphone brands. With customers in the data center segment expected to ramp up procurement in 2Q21, NAND Flash suppliers have decided to scale back the supply of NAND Flash wafers. Compared with other product categories, wafers have a lower gross margin. As a result of these factors, the decline in contract prices of wafers has been easing over the past two months (i.e., from December of last year to January of this year).
Not only did automotive market take a downward turn starting in 2018, but the severe impact of the COVID-19 pandemic in 2020 also led to noticeably insufficient procurement activities from major automotive module suppliers, according to TrendForce’s latest investigations. However, as the automotive market is currently set to make a recovery, TrendForce expects yearly vehicle sales to increase from 77 million units in 2020 to 84 million units in 2021. At the same time, the rising popularity of autonomous, connected, and electric vehicles is likely to lead to a massive consumption of various semiconductor components. Even so, since most manufacturers in the automotive supply chain currently possess a relatively low inventory, due to their sluggish procurement activities last year in light of weak demand, the discrepancies in the inventory levels of various automotive components, along with the resultant manufacturing bottleneck, have substantially impaired automakers’ capacity utilization rates and, subsequently, vehicle shipments.
Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H21, Intel’s mid-range and high-end CPUs are projected to enter mass production using TSMC’s 3nm node in 2H22.
An abnormality which caused a power outage in the GIS (gas insulated switchgear) equipment at UMC’s facilities on Lixing Road, Hsinchu, resulted in a voltage drop for other fabs located in the surrounding area, according to TrendForce’s latest investigations. Affected foundries include TSMC, Vanguard, and PSMC. However, TrendForce’s investigations also reveal that, apart from the temporary power outage at UMC’s Lixing fabs, facilities operated by TSMC, Vanguard, and PSMC experienced only a temporary voltage drop. While the uninterruptible power supplies of the facilities kicked in shortly after the outage, normal manufacturing operations resumed following certain equipment crashes that occurred during the transition from one power source to another. UMC’s Lixing fab has currently resumed operations after about four hours of power outage, and TrendForce expects the impact from this incident to be minimal.
Global foundry revenue is expected to reach US$84.6 billion in 2020 by undergoing a 23.7% YoY growth, which is the highest % growth in nearly 10 years, according to TrendForce’s latest investigations. This performance took place on the backs of several developments, including OEMs’ aggressive inventory procurement brought about by the COVID-19 pandemic and the “new normal” involving WFH and distance education in 1H20. The second half of the year, on the other hand, saw U.S. sanctions tilting forward Huawei’s component demand, as well as the increased penetration rate of 5G smartphones and increased 5G base station build-outs.