Global foundry revenue is expected to reach US$84.6 billion in 2020 by undergoing a 23.7% YoY growth, which is the highest % growth in nearly 10 years, according to TrendForce’s latest investigations. This performance took place on the backs of several developments, including OEMs’ aggressive inventory procurement brought about by the COVID-19 pandemic and the “new normal” involving WFH and distance education in 1H20. The second half of the year, on the other hand, saw U.S. sanctions tilting forward Huawei’s component demand, as well as the increased penetration rate of 5G smartphones and increased 5G base station build-outs.
In the upstream semiconductor industry, the major foundries such as TSMC and UMC are reporting fully loaded capacities, while in the downstream, the available production capacity for OSAT is also lacking, according to TrendForce’s latest investigations.
Apple’s release of the iPhone 12, which has been popular in the consumer markets, led to soaring demand for Qualcomm’s 5G modems and RF chips, in turn propelling Qualcomm’s revenues past that of its rival Broadcom once again to clinch the number one spot in the revenue ranking of global top 10 IC design (fabless) companies for 3Q20, according to TrendForce’s latest investigations.
The percentage distribution of 2021 NAND Flash bit demand by application currently shows that client SSD accounts for 31%, enterprise SSD 20%, eMMC/UFS 41%, and NAND wafer 8%, according to TrendForce’s latest investigations. TrendForce expects NAND Flash ASP to undergo QoQ declines throughout 2021, since the number of NAND suppliers far exceeds DRAM suppliers, and the bit supply remains high. As Samsung, YMTC, SK Hynix, and Intel actively expand their NAND Flash bit output in 1Q21, the oversupply situation in the industry will become more severe, with a forecasted 6% QoQ increase in NAND Flash bit output and a 10-15% QoQ decline in NAND Flash ASP in 1Q21.
An earthquake that was 6.7 in magnitude occurred off the eastern coast of Taiwan at 9:19 p.m. on December 10. Right after the earthquake had struck, TrendForce immediately began checking the operational statuses of the semiconductor plants in Taiwan and surveying the possible damages resulting from the event. The investigation so far finds that the DRAM fabs on the island have already resumed normal operation following a brief suspension of their production lines. The DRAM fabs in Taiwan are mostly located in the northern and central parts of the island, whereas the epicenter of the earthquake was in the eastern sea of the island. After the tremor had stopped, local DRAM manufacturers temporarily suspended the operation of their production lines to inspect equipment. Currently, they have not reported any significant damages to their plant buildings and equipment. Furthermore, they have all returned to normal production. Hence, the earthquake appears to have not caused any tangible capacity losses for Taiwan’s DRAM industry. Likewise, Taiwanese foundries have not been affected by the earthquake to any meaningful degree.