According to the DRAMeXchange research division of TrendForce, the global server market has slowed its growth in 2019 in light of factors such as the current global trade situation and the shift of ODM production lines. However, as the China-U.S. trade relations improved in 2H19, market demand also returned to form, with data centers being the main driver of market growth.
According to the latest analysis of TrendForce’s DRAMeXchange research division, DRAM spot prices have begun to rebound, in turn improving the overall DRAM market sentiment, and memory component buyers in the contract market will be induced to raise their inventories as well. Contract prices are expected to rally as early as 1Q20.
According to the latest analysis from the WitsView research division of TrendForce, as electronic device manufacturers start to develop product strategies for the 2020 market driven by the commercialization of 5G technology, foundries are likewise raising their capacity utilization rates. Specifically, 8-inch and 12-inch wafer fabs of large foundries are estimated to reach near-maximum production capacities in 4Q19, thus compressing the supply of large-sized DDI and small-sized TDDI.
According to the latest statistics from TrendForce, under the influence of foundries’ inventory-reduction efforts and expectation-shattering seasonal demand, the projected 4Q19 revenue of the global foundry industry surpasses the previous quarter by 6%. The top three market leaders are TSMC, Samsung, and GlobalFoundries, with market shares of 52.7%, 17.8%, and 8%, respectively.
The newest analysis from TrendForce shows that several U.S.-based IC design companies experienced continually expanding losses in 3Q19 revenue because of the ongoing China-U.S. trade war and because Huawei had yet to be removed from the Entity List. Of the U.S.-based companies, Qualcomm demonstrated the greatest revenue loss with a 22% decline.
