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TrendForce reports that significant capital investments have occurred in the memory sector due to the high ASP and profitability of HBM. Senior Vice President Avril Wu notes that by the end of 2024, the DRAM industry is expected to allocate approximately 250K/m (14%) of total capacity to producing HBM TSV, with an estimated annual supply bit growth of around 260%. Additionally, HBM’s revenue share within the DRAM industry—around 8.4% in 2023—is projected to increase to 20.1% by the end of 2024.
TrendForce’s projections foresee that the US satellite direct-to-device (D2D) market is expected to undergo significant growth, expanding from $430 million in 2023 to $6.5 billion by 2027 at a CAGR of 36%. This growth is driven by increasing subscriptions to satellite D2D services, potentially enabling telecom operators to expand beyond traditional mobile communication services into satellite communications.
TrendForce highlights the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3. NVIDIA’s upcoming B100 or H200 models will incorporate advanced HBM3e, signaling the next step in memory technology. The challenge, however, is the supply bottleneck caused by both CoWoS packaging constraints and the inherently long production cycle of HBM—extending the timeline from wafer initiation to the final product beyond two quarters.
The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world’s top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs.
TrendForce’s latest insights reveal a significant rebound in global smartphone production, marking the end of an eight-quarter slump in 3Q23. In a strategic year-end surge, brands amped up production to capture more market share, propelling Q4 smartphone output up 12.1% to reach 337 million units.
