Press Center

Press Releases




Taiwanese IC Packaging/Testing Industry to Enter a New Phase as Cooperation Between ASE and SPIL Becomes Likely, Says TrendForce

27 May 2016

Two major IC packaging/testing providers based in Taiwan, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), signed a joint share-exchange memorandum of understanding on May 26 to establish a new holding company. According to the memorandum, each common ASE share will be swapped for a 0.5 share of the holding company, while each common SPIL share will be sold to the holding company at a price of NT$55.

SSD Adoption in Notebooks May Hit 40% by Year’s End Due to Maturation of TLC Products and Rising HDD Prices, Says TrendForce

27 May 2016

In the mainstream PC-Client OEM SSD market for the second quarter, the average contract prices of TLC- and MLC-based products respectively fell 4~11% and 6~10% compared with the prior quarter, according to DRAMeXchange, a division of TrendForce. Looking ahead to the third quarter, the overall supply-demand situation in the NAND Flash market may become more balanced.


  • Page 320
  • 788 page(s)
  • 3937 result(s)

Get in touch with us