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Groundbreaking of the New XMC Memory Fab in China at the End of March Signals another Breakthrough in Chinese NAND Flash Industry, Says TrendForce

21 March 2016

Major Chinese memory manufacturer XMC will begin the construction of a new wafer fab at the end of March. This fab is expected to enter production by the start of 2018 and its main strategic product at the outset will be 3D-NAND Flash, the most advanced Flash memory product available on the market.


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