TrendForce’s latest research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung’s HBM3 (24GB) is anticipated to complete verification with NVIDIA by December this year. The progress of HBM3e, as outlined in the timeline below, shows that Micron provided its 8hi (24GB) samples to NVIDIA by the end of July, SK hynix in mid-August, and Samsung in early October.
Despite strong shipments of NVIDIA’s high-end GPUs—and the rapid introduction of compliant products such as the H20, L20, and L2—Chinese cloud operators are still in the testing phase, making substantial revenue contributions to NVIDIA unlikely in Q4. Gradual shipments increases are expected from the first quarter of 2024.
TrendForce reports a significant 8.9% decrease in shipments of smartphone camera modules in 2023, totaling around 4.065 billion units. This downturn is attributed to a decline in smartphone production and evolving trends in camera integration by major brands.
TrendForce reports that global demand for MLCCs is set to experience a period of slow growth from 2023 to 2024. With limited opportunities for industry growth, the demand for MLCCs in 2023 is estimated to be around 4.193 trillion units, with a modest annual growth rate of about 3%.
TrendForce reports that the utilization rates for the Gen5+ LCD panel industry (by area) are estimated to decrease by nearly 9.2 percentage points from the third quarter, reaching 72.2% in Q4.
