While gasoline cars still dominate exports, the tides are turning rapidly. NEVs accounted for a staggering 25% of Chinese auto exports 1Q23, establishing them as the focal point for future global expansion, according to TrendForce's report "An Analysis of the Overseas Expansion of Chinese Car Brands".
TrendForce forecasts that global demand for HBM will experience almost 60% growth annually in 2023, reaching 290 million GB, with a further 30% growth in 2024.
TrendForce’s latest forecast predicts global TV shipments for 2Q23 will reach 46.63 million units—a 7.5% increase QoQ, a 2% growth YoY. The uptick in shipments is primarily due to strong stockpiling momentum from Chinese brands for the 618 e-commerce shopping festival.
TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia’s A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3.
TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry’s traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.