Press Center

Press Releases




Weak Consumer Demand Leads to 28% Decline in DRAM Module Revenue in 2023, Says TrendForce

7 November 2024

TrendForce’s latest analysis reveals that the global revenue for the DRAM module market reached US$12.5 billion in 2023—a YoY decline of 28%. This drop was primarily attributed to the inventory correction period for consumer electronics following the pandemic, which drove down DRAM prices. High utilization rates by DRAM suppliers further intensified the price decline, before the market began to rebound in the second half of 2023.

DRAM Suppliers Must Carefully Plan Capacity to Maintain Profitability Amid Rising Bit Output in 2025, Says TrendForce

6 November 2024

The DRAM industry experienced inventory reductions and price recovery in the first three quarters of 2024; however, pricing momentum is expected to weaken in the fourth quarter. TrendForce’s Senior Vice President of Research, Avril Wu, noted that some DRAM suppliers, after achieving profitability this year, have begun planning new capacity expansions. This could lead to a 25% YoY increase in total DRAM bit output in 2025—marking a more substantial growth compared to 2024.

Solid-State Batteries Enter Pilot Production, Costs Expected to Drop to CNY 0.6–0.7/Wh by 2035, Says TrendForce

31 October 2024

The global pursuit and anticipation of applications for solid-state batteries (SSBs) have accelerated the commercialization process of this technology. TrendForce’s latest findings reveal that major manufacturers across the globe, such as Toyota, Nissan, and Samsung SDI have already begun pilot production of all-solid-state batteries. It is estimated that production volumes could have GWh levels by 2027 as these companies race to scale up production.

HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models, Says TrendForce

30 October 2024

TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding. Major HBM manufacturers are considering whether to adopt hybrid bonding for HBM4 16hi stack products but have confirmed plans to implement this technology in the HBM5 20hi stack generation.

Mature Process Capacity to Grow 6% in 2025; Chinese Foundries Lead Expansion, Says TrendForce

24 October 2024

The latest investigations by TrendForce reveal that Chinese foundries are set to drive the bulk of mature process capacity growth in 2025, thanks to China’s domestic IC substitution policies. It is estimated that the capacity of the world’s top 10 mature process foundries will increase by 6% in 2025, though pricing pressures will persist.


  • Page 1
  • 775 page(s)
  • 3874 result(s)

Get in touch with us